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SNJ54BCT374J

Texas Instruments

SNJ54BCT374J by Texas Instruments

SNJ54BCT374J by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.6 ns at 5V, suitable for military applications. It features a max frequency of 70 MHz, operates in the temperature range of -55 to 125°C, and has a power supply current of 60 mA.

Median Price

$48.398

Lifecycle Status

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Rochester

USA . 189 parts In-Stock

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-

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$43.020

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$38.490

10k+ parts

$36.220

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$43.020

$38.490

$36.220

DigiKey

USA . 189 parts In-Stock

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Verical

USA . 137 parts In-Stock

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$53.775

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$48.112

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$45.275

137

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$53.775

$48.112

$45.275

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Freelance Electronics

USA . 251 parts In-Stock

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$26.260

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$27.573

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$25.997

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$26.260

$27.573

$25.997

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Bristol Electronics

USA . 71 parts In-Stock

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$39.216

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$33.185

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Digiode

USA . 4,827 parts In-Stock

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$39.482

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Vyrian

USA . 1,980 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 71 parts In-Stock

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Dan-Mar Components

USA . 71 parts In-Stock

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Beltway Electronics Company

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Resion

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Electronics Depot

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Holdelec - ElecDif-Pro

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Elcom Components

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Andel Nordic

Denmark . 852 parts In-Stock

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$4.204

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$4.036

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$4.036

852

$4.204

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$4.036

$4.036

Parana Technologies

USA . 855 parts In-Stock

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$14.515

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$14.955

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855

$14.515

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$14.955

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DigiPath Technology Company

USA . 721 parts In-Stock

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$15.983

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$14.704

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$15.983

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ChromeModa Solutions

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$16.309

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$13.373

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$16.309

$13.373

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IDEA Electronic Components Group

UK . 147 parts In-Stock

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$16.309

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$15.494

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$14.678

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Corphita

USA . 505 parts In-Stock

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Microchip USA

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Kepictronics

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Assy Fe

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Overview

Experience unparalleled performance and reliability with the SNJ54BCT374J by Texas Instruments, a leading manufacturer in the industry. Designed for bus driver & transceiver applications, this product offers exceptional value with its high-quality ceramic, glass-sealed package body material and military screening level. With a fast propagation delay and 3-STATE output characteristics, this 8-bit device ensures efficient signal transmission. Trust in Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 11.6 ns

Ensures fast signal transmission, making the product efficient for time-sensitive applications.

Screening Level: MIL-PRF-38535

Meets military standards for quality and reliability, ensuring consistent performance in demanding conditions.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

No. of Bits: 8

Provides sufficient data handling capability for various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with most systems.

Load Capacitance (CL): 50 pF

Optimized for efficient signal transmission with typical loads.

Power Supplies (V): 5

Compatibility with standard power sources for easy integration.

No. of Terminals: 20

Provides ample connection points for interfacing with other components.

Package Style (Meter): IN-LINE

Space-saving design for compact circuit layouts.

Maximum I (ol): 48 Amp

High output current capability for driving external loads.

Output Characteristics: 3-STATE

Allows for multiple devices to share a common bus, enhancing versatility.

Trigger Type: POSITIVE EDGE

Facilitates synchronous data transmission for accurate signal processing.

Minimum Operating Temperature: -55 °C

Suitable for operation in extreme temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides reliable solder connections for long-term performance.

No. of Ports: 2

Supports multiple connections for increased data routing flexibility.

Maximum Seated Height: 5.08 mm

Low-profile design for space-constrained applications.

Width: 7.62 mm

Compact form factor for efficient circuit board layout.

Output Polarity: TRUE

Ensures consistent logic levels for proper signal interpretation.

Minimum Supply Voltage (Vsup): 4.5 V

Wide voltage input range for compatibility with different power sources.

Length: 24.195 mm

Optimal size for fitting into various device enclosures.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies for enhanced performance.

Packing Method: TUBE

Protects the components during storage and transportation.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and durability.

Maximum Frequency At Nominal Supply: 70000000 Hz

Supports high-speed data transmission in demanding applications.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering onto circuit boards for secure connections.

Terminal Pitch: 2.54 mm

Standard spacing for compatibility with common PCB designs.

Count Direction: UNIDIRECTIONAL

Simplifies data flow control for streamlined operation.

Control Type: ENABLE LOW

Allows for easy control of signal transmission with a low-enable input.

Maximum Supply Voltage (Vsup): 5.5 V

Safe operating range for preventing overvoltage damage.

Maximum Power Supply Current (ICC): 60 mA

Efficient power consumption for extended device operation.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT374J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

11.6 ns

Propagation Delay (tpd):

11.6 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SNJ54BCT374J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-388-7522, 5962013887522

NIIN

013887522

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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