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SNJ54ALS251J

Texas Instruments

SNJ54ALS251J by Texas Instruments

SNJ54ALS251J by Texas Instruments is an 8-bit multiplexer with a propagation delay of 24 ns at 5V. It operates in a temperature range of -55 to 125°C and has a max power supply current of 10mA. Ideal for military applications requiring high-speed data switching in harsh environments.

Median Price

$17.212

Lifecycle Status

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25

In-Stock Inventory

1k+

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Rochester

USA . 84 parts In-Stock

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$15.300

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$13.690

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$12.890

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$12.890

DigiKey

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Verical

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Chip1Stop

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Freelance Electronics

USA . 83 parts In-Stock

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$3.994

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$4.193

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$3.954

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Digiode

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Vyrian

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DigiKey Marketplace

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Electronic Expediters

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Beltway Electronics Company

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Resion

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ECAB

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North Shore Components

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Electro Mavin

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Manoshevitz Elec. Sales

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Bristol Electronics

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PC Components Company LLC

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MISTER SPROCKETS

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First Choice Components Inc.

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Speed Components Ltd

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LWI Electronics Inc

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Parana Technologies

USA . 689 parts In-Stock

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Corphita

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ChromeModa Solutions

Germany . 5,694 parts In-Stock

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IDEA Electronic Components Group

UK . 1,991 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

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Overview

Unlock the power of advanced technology with the SNJ54ALS251J by Texas Instruments, a leading manufacturer known for superior quality and reliability. This multiplexer & demultiplexer offers unparalleled performance and precision, making it ideal for a wide range of applications. Experience seamless operation and enhanced efficiency with this versatile component that provides exceptional value and benefits to customers seeking top-notch electronic solutions. Elevate your projects with the SNJ54ALS251J and discover the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

High durability and reliability, ensuring the product can withstand harsh environments.

Propagation Delay At Nominal Supply: 24 ns

Fast signal processing speed, ideal for time-sensitive applications.

No. of Inputs: 8

Allows for multiple input signals to be multiplexed or demultiplexed, increasing flexibility.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with a wide range of systems.

Output Characteristics: 3-STATE

Ability to disconnect outputs, providing additional flexibility in circuit design.

Technical Specifications

Multiplexer & Demultiplexer SNJ54ALS251J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54ALS251J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-240-9243, 5962012409243

NIIN

012409243

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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