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SNJ54ACT16373WD

Texas Instruments

SNJ54ACT16373WD by Texas Instruments

SNJ54ACT16373WD by Texas Instruments is a CMOS bus driver with 8 bits, 3-STATE output, and propagation delay of 13.7 ns at 5V. It is used in military applications due to MIL-PRF-38535 screening, operates b/w -55°C to 125°C, and has a flatpack package style for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,362 parts In-Stock

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Digiode

USA . 3,732 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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Electronic Expediters

USA . 6 parts In-Stock

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Andel Nordic

Denmark . 582 parts In-Stock

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$7.612

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$7.308

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$7.308

582

$7.612

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$7.308

AZTECH Wire

Italy . 242 parts In-Stock

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$9.995

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Parana Technologies

USA . 910 parts In-Stock

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$19.989

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$19.925

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$22.010

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$20.249

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ChromeModa Solutions

Germany . 2,260 parts In-Stock

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$22.459

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$18.416

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IDEA Electronic Components Group

UK . 2,074 parts In-Stock

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$22.459

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$21.336

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$20.213

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One Stop Electronics

USA . 661 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the SNJ54ACT16373WD from Texas Instruments, a leading manufacturer in the industry. This high-quality bus driver & transceiver offers unmatched reliability and performance, making it ideal for a wide range of applications. With its 3-state output characteristics and dual terminal position, this product provides exceptional value by delivering fast propagation delays and a true output polarity. Trust Texas Instruments to deliver cutting-edge technology that meets the demands of even the most complex projects. Elevate your designs with the SNJ54ACT16373WD and experience the advantages of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body material provides durability and reliability, ensuring the product can withstand harsh environments and temperature variations.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay at nominal supply voltage ensures fast and efficient data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional chips, simplifying circuit design and reducing costs.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 screening standards ensures high reliability and performance in critical military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources, increasing versatility and ease of integration.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable and efficient operation in various circuit configurations, improving overall performance.

Power Supplies (V): 5

Consistent power supply voltage of 5V enhances reliability and compatibility with standard electronic systems.

No. of Terminals: 48

Having a high number of terminals allows for flexible connectivity options and enables complex signal routing in the circuit design.

Package Style (Meter): FLATPACK

Flatpack package style provides a compact and space-saving design, ideal for applications where board space is limited.

Maximum I (ol): 24 Amp

High output current capability of 24A ensures reliable performance in driving external loads without the risk of overheating or damage.

Output Characteristics: 3-STATE

3-state output allows for multiple logic states (high, low, and high-impedance) providing flexibility in signal routing and control.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SNJ54ACT16373WD attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-GDFP-F48

JESD-609 Code:

e0

Length:

15.748 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

13.7 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

3.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

9.652 mm

Trade Compliance

SNJ54ACT16373WD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-444-4110, 5962014444110

NIIN

014444110

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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