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SNJ54AC373FK

Texas Instruments

SNJ54AC373FK by Texas Instruments

SNJ54AC373FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 16.5 ns, suitable for military-grade applications. It operates at a nominal voltage of 3.3V and features a 3-STATE output characteristic, making it ideal for high-speed data transmission in harsh environments. With surface mount capability and low power consumption, this chip carrier package is designed for compact electronic systems requiring reliable signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,421 parts In-Stock

1+ parts

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6,421

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Digiode

USA . 3,158 parts In-Stock

1+ parts

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3,158

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 457 parts In-Stock

1+ parts

$4.508

100+ parts

-

1k+ parts

$4.327

10k+ parts

$4.327

457

$4.508

-

$4.327

$4.327

Parana Technologies

USA . 559 parts In-Stock

1+ parts

$10.253

100+ parts

-

1k+ parts

$10.789

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559

$10.253

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$10.789

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One Stop Electronics

USA . 995 parts In-Stock

1+ parts

$11.000

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-

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995

$11.000

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ChromeModa Solutions

Germany . 1,562 parts In-Stock

1+ parts

$11.520

100+ parts

$9.446

1k+ parts

-

10k+ parts

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1,562

$11.520

$9.446

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IDEA Electronic Components Group

UK . 521 parts In-Stock

1+ parts

$11.520

100+ parts

$10.944

1k+ parts

$10.368

10k+ parts

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521

$11.520

$10.944

$10.368

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AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$16.996

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654

$16.996

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Corphita

USA . 4,201 parts In-Stock

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4,201

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DigiPath Technology Company

USA . 1,381 parts In-Stock

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$10.386

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1,381

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$10.386

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Microchip USA

USA . 1,344 parts In-Stock

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1,344

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Speed Components Ltd (Excess)

Israel . 5 parts In-Stock

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Overview

Experience seamless data transmission with the SNJ54AC373FK by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch bus drivers and transceivers that are ideal for a variety of applications. Whether you're working on a project that requires precise timing or need efficient signal routing capabilities, this product offers unmatched value, benefits, and advantages. Trust in Texas Instruments to provide the technology you need to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 16.5 ns

With a low propagation delay, this product offers fast signal processing, making it efficient for communication applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package provides a compact design, enabling more efficient use of board space.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V nominal supply voltage is common and widely available, ensuring compatibility with a variety of systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for high signal integrity and flexibility in controlling the output state, enhancing the product's functionality.

Maximum Operating Temperature: 125°C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability and longevity.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SNJ54AC373FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

16.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54AC373FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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