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SNJ54AC11240FK

Texas Instruments

SNJ54AC11240FK by Texas Instruments

SNJ54AC11240FK by Texas Instruments is a CMOS bus driver with 2 functions, 4 bits, and 3-STATE output. It operates at temperatures ranging from -55 to 125°C and supports power supplies of 3.3/5V. Ideal for military applications requiring inverted output polarity in a square chip carrier package.

Median Price

$9.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$7.600

1k+ parts

$6.800

10k+ parts

$6.400

48

-

$7.600

$6.800

$6.400

DigiKey

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$10.000

1k+ parts

-

10k+ parts

-

48

-

$10.000

-

-

Verical

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$9.500

1k+ parts

$8.500

10k+ parts

$8.000

48

-

$9.500

$8.500

$8.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,789 parts In-Stock

1+ parts

$8.018

100+ parts

-

1k+ parts

-

10k+ parts

-

2,789

$8.018

-

-

-

Vyrian

USA . 8,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,904

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,890 parts In-Stock

1+ parts

$4.274

100+ parts

-

1k+ parts

$4.103

10k+ parts

$4.103

2,890

$4.274

-

$4.103

$4.103

Corphita

USA . 2,217 parts In-Stock

1+ parts

$7.596

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

$7.596

-

-

-

Component Stockers USA

USA . 114 parts In-Stock

1+ parts

$8.680

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$8.680

-

-

-

Microchip USA

USA . 972 parts In-Stock

1+ parts

$22.680

100+ parts

$22.360

1k+ parts

$22.190

10k+ parts

$22.030

972

$22.680

$22.360

$22.190

$22.030

Parana Technologies

USA . 933 parts In-Stock

1+ parts

$27.968

100+ parts

-

1k+ parts

$42.274

10k+ parts

-

933

$27.968

-

$42.274

-

DigiPath Technology Company

USA . 347 parts In-Stock

1+ parts

$30.796

100+ parts

$28.333

1k+ parts

-

10k+ parts

-

347

$30.796

$28.333

-

-

ChromeModa Solutions

Germany . 2,271 parts In-Stock

1+ parts

$31.425

100+ parts

$25.768

1k+ parts

-

10k+ parts

-

2,271

$31.425

$25.768

-

-

IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$31.425

100+ parts

$29.854

1k+ parts

$28.282

10k+ parts

-

180

$31.425

$29.854

$28.282

-

Overview

Enhance your electronic designs with the SNJ54AC11240FK by Texas Instruments, a top-tier manufacturer known for their high-quality components. As part of the Bus Driver & Transceivers category, this product offers reliable performance and versatility for a wide range of applications. With its advanced technology and military-grade temperature grade, this chip carrier package ensures optimal functionality in extreme conditions. Trust Texas Instruments to deliver superior power supplies, inverted output polarity, and 3-state characteristics, making it the ideal choice for your next project. Upgrade your designs with the SNJ54AC11240FK and experience the value and benefits it brings to your electronic systems.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides better thermal conductivity and higher reliability, making the product suitable for harsh operating environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall product size.

No. of Functions: 2

Having multiple functions in a single device increases functionality and reduces the need for additional components, simplifying circuit design.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures the product's reliability and performance in various operating conditions.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and provides ease of handling during assembly.

No. of Bits: 4

Having 4 bits allows for a higher resolution in data transmission, improving the accuracy and performance of the device.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages provides flexibility in system integration and compatibility with different design requirements.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and enables the device to interface with other components effectively.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high thermal conductivity and reliability, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the device's reliability and performance in extreme temperature conditions.

Output Characteristics: 3-STATE

3-state output allows the device to drive multiple loads without affecting the overall system performance, enhancing versatility.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the device's reliable operation in cold environments, expanding its usability range.

Terminal Position: QUAD

Quad terminal position facilitates easy and efficient connection to external components, enhancing the overall usability of the product.

Output Polarity: INVERTED

Inverted output polarity allows for compatibility with a wider range of devices and enhances signal integrity in complex systems.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the device's durability and performance in harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high-speed operation, enhancing the overall efficiency and performance of the device.

Terminal Form: NO LEAD

No lead terminal form ensures environmentally friendly manufacturing and disposal practices, making the product a sustainable choice.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for compact and efficient PCB layout, reducing signal interference and enhancing overall system performance.

Control Type: ENABLE LOW

Enable low control type offers flexibility in system integration and operation, allowing for seamless interaction with other components.

Technical Specifications

Bus Driver & Transceivers SNJ54AC11240FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

S-XQCC-N28

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54AC11240FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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