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SN74LVTH573DBRE4

Texas Instruments

SN74LVTH573DBRE4 by Texas Instruments

SN74LVTH573DBRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 3.3V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85 °C) and supports true output polarity, making it ideal for applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 4,191 parts In-Stock

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Vyrian

USA . 3,868 parts In-Stock

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Digiode

USA . 341 parts In-Stock

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One Stop Electronics

USA . 753 parts In-Stock

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$3.000

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753

$3.000

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Andel Nordic

Denmark . 2,991 parts In-Stock

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$5.394

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$5.178

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$5.178

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$5.178

AZTECH Wire

Italy . 891 parts In-Stock

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$11.424

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891

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Parana Technologies

USA . 845 parts In-Stock

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$21.752

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$22.206

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845

$21.752

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DigiPath Technology Company

USA . 2,315 parts In-Stock

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$23.952

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ChromeModa Solutions

Germany . 3,326 parts In-Stock

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$24.441

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$20.042

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IDEA Electronic Components Group

UK . 531 parts In-Stock

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$24.441

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$23.219

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$21.997

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531

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Component Stockers USA

USA . 728 parts In-Stock

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$99.990

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Microchip USA

USA . 2,670 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVTH573DBRE4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This bus driver and transceiver is perfect for applications requiring fast data transfer and low power consumption. With its 3-STATE output characteristics and 8-bit configuration, this product offers exceptional value and performance. Trust Texas Instruments to provide cutting-edge technology that meets all your design needs. Upgrade your projects with the SN74LVTH573DBRE4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and light weight, making it ideal for portable applications.

Propagation Delay At Nominal Supply: 3.9 ns

With a low propagation delay, this transceiver provides fast signal transmission, crucial for efficient communication in bus driver applications.

Surface Mount: YES

Being surface mountable, this transceiver can be easily integrated into compact circuit designs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V simplifies power requirements and compatibility with other components in the system.

Output Characteristics: 3-STATE

The 3-state output allows the transceiver to effectively control the bus line by presenting three output states - logic high, logic low, and high impedance.

Technical Specifications

Bus Driver & Transceivers SN74LVTH573DBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74LVTH573DBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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