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SN74LVTH240DWRE4

Texas Instruments

SN74LVTH240DWRE4 by Texas Instruments

SN74LVTH240DWRE4 by Texas Instruments is a 3-STATE bus driver with 4.6 ns propagation delay at 3.3V, ideal for industrial applications. It features 2 functions, operates b/w -40 to 85°C, and has a max power supply current of 5mA. This small outline package with gull wing terminals is suitable for unidirectional control at up to 3.6V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,011 parts In-Stock

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Digiode

USA . 4,795 parts In-Stock

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4,795

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One Stop Electronics

USA . 532 parts In-Stock

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$4.000

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532

$4.000

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AZTECH Wire

Italy . 702 parts In-Stock

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$7.515

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702

$7.515

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Parana Technologies

USA . 1,874 parts In-Stock

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$26.687

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$27.288

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$26.687

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DigiPath Technology Company

USA . 1,505 parts In-Stock

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$29.385

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1,505

$29.385

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IDEA Electronic Components Group

UK . 1,829 parts In-Stock

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$29.985

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$28.486

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$26.986

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1,829

$29.985

$28.486

$26.986

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ChromeModa Solutions

Germany . 1,337 parts In-Stock

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$29.985

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$24.588

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$29.985

$24.588

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Andel Nordic

Denmark . 3,909 parts In-Stock

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$48.883

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$46.927

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$46.927

3,909

$48.883

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$46.927

Corphita

USA . 3,833 parts In-Stock

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Microchip USA

USA . 2,757 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVTH240DWRE4 from Texas Instruments, a top-tier manufacturer known for its high-quality products. As a versatile Bus Driver & Transceiver, this component offers fast propagation delays and 3-STATE output characteristics, making it ideal for a wide range of applications. With a compact package style and dual terminal position, this product provides exceptional value and performance. Upgrade your projects today with the SN74LVTH240DWRE4 and experience the benefits of superior technology and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for a portable device like a bus driver.

Propagation Delay At Nominal Supply: 4 ns

The low propagation delay ensures fast and efficient data transmission, crucial for real-time communication in a bus driver system.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in electronic systems, ensuring compatibility with a wide range of devices.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components and peripherals in a bus driver system.

Output Polarity: INVERTED

The inverted output polarity can be useful for certain applications where a complementary signal is required, adding versatility to the product.

Technical Specifications

Bus Driver & Transceivers SN74LVTH240DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74LVTH240DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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