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SN74LVTH16373GQLR

Texas Instruments

SN74LVTH16373GQLR by Texas Instruments

SN74LVTH16373GQLR by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.8 ns at 3.3V, suitable for industrial applications. It features a very thin profile package style, operates b/w -40 to 85 °C, and has a max supply voltage of 3.6 V.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.360

160

-

$1.620

$1.450

$1.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,449 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,449

$1.700

-

-

-

Vyrian

USA . 4,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,652

-

-

-

-

R&J Components

USA . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

915

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,598 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

$1.076

10k+ parts

$1.076

1,598

$1.120

-

$1.076

$1.076

Corphita

USA . 3,105 parts In-Stock

1+ parts

$1.611

100+ parts

-

1k+ parts

-

10k+ parts

-

3,105

$1.611

-

-

-

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

$7.825

100+ parts

-

1k+ parts

$8.378

10k+ parts

-

2,179

$7.825

-

$8.378

-

ChromeModa Solutions

Germany . 6,476 parts In-Stock

1+ parts

$8.792

100+ parts

$7.209

1k+ parts

-

10k+ parts

-

6,476

$8.792

$7.209

-

-

IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$8.792

100+ parts

$8.352

1k+ parts

$7.913

10k+ parts

-

2,121

$8.792

$8.352

$7.913

-

AZTECH Wire

Italy . 1,061 parts In-Stock

1+ parts

$13.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,061

$13.640

-

-

-

DigiPath Technology Company

USA . 482 parts In-Stock

1+ parts

-

100+ parts

$7.927

1k+ parts

-

10k+ parts

-

482

-

$7.927

-

-

Microchip USA

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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252

-

-

-

-

Overview

Elevate your electronic designs with the SN74LVTH16373GQLR by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This bus driver & transceiver is versatile, offering 8 bits of data transfer with a fast propagation delay of just 3.8 ns. Perfect for industrial applications, this product features a low power supply voltage of 3.3V and a wide operating temperature range. With its 3-state output characteristics and compact design, the SN74LVTH16373GQLR delivers exceptional performance and value to customers looking for high-quality components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand the rigors of everyday use, making the product long-lasting.

Propagation Delay At Nominal Supply: 3.8 ns

With a low propagation delay, this product ensures fast and efficient transmission of data.

Surface Mount: YES

Being surface mountable makes the installation of this product easy and convenient.

No. of Functions: 2

Having multiple functions in one device provides versatility and saves space in the overall design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a commonly used supply voltage of 3.3V makes this product compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a circuit board.

No. of Bits: 8

Having 8 bits ensures that this product can handle a reasonable amount of data.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance under varying load conditions.

Power Supplies (V): 3.3

The consistent power supply of 3.3V ensures reliable operation of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for a compact design and efficient use of space on a PCB.

Maximum I (ol): 64 Amp

With a high maximum output current, this product can drive demanding loads without any issues.

Propagation Delay (tpd): 4.8 ns

The low propagation delay of 4.8 ns ensures fast data transmission and minimal signal distortion.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for multi-drop bus applications and flexible control of the output signal.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in cold environments without any issues.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to connect and integrate this product into existing systems.

No. of Ports: 2

Having 2 ports allows for easy interfacing with multiple devices or systems.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a slim and compact overall product design.

Width: 4.5 mm

The narrow width of 4.5 mm saves space on the PCB and allows for a more efficient layout.

Output Polarity: TRUE

Having true output polarity ensures the correct interpretation of data signals by connected devices.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V allows for operation in low power or battery-operated systems.

Peak Reflow Temperature °C: 240

With a high peak reflow temperature of 240°C, this product can withstand the reflow soldering process without any damage.

Length: 7 mm

The compact length of 7 mm contributes to the overall small footprint of the product on the PCB.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures reliable operation in harsh industrial environments.

Technology: BICMOS

The use of BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: BALL

The ball terminal form improves connectivity and reliability of the product.

Packing Method: TR

The TR packing method ensures ease of handling and protection during transportation and storage.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm allows for a high-density layout and efficient use of space on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in operating this product in various systems.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16373GQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e0

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

4.5 mm

Trade Compliance

SN74LVTH16373GQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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