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SN74LVTH162245DGG

Texas Instruments

SN74LVTH162245DGG by Texas Instruments

SN74LVTH162245DGG by Texas Instruments is a Bus Driver & Transceiver with 8-bit capacity, 4.6 ns propagation delay, and 3.3V nominal voltage. Ideal for industrial applications, it features a small outline package with dual terminals and operates b/w -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 8,390 parts In-Stock

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Vyrian

USA . 5,928 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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Digiode

USA . 2,609 parts In-Stock

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Bristol Electronics

USA . 1,686 parts In-Stock

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Speed Components Ltd

Israel . 96 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 90 parts In-Stock

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Electronics Depot

USA . 29 parts In-Stock

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Prism Electronics

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Flex Direct, LLC

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Parana Technologies

USA . 509 parts In-Stock

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$10.799

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$11.280

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509

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DigiPath Technology Company

USA . 129 parts In-Stock

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$11.891

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ChromeModa Solutions

Germany . 3,221 parts In-Stock

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$9.950

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IDEA Electronic Components Group

UK . 1,629 parts In-Stock

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AZTECH Wire

Italy . 1,008 parts In-Stock

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Andel Nordic

Denmark . 1,729 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the high-quality SN74LVTH162245DGG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable solutions for Bus Drivers & Transceivers. This product offers 3-state output with series resistor, true output polarity, and a fast propagation delay of 4.6ns. Perfect for industrial applications, this IC operates at temperatures ranging from -40°C to 85°C, providing customers with efficiency and durability. Upgrade your projects with the exceptional value and performance of the SN74LVTH162245DGG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

The surface mount feature enables easy installation and saves space on the circuit board.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, leading to cost savings and simplified design.

Nominal Supply Voltage: 3.3V

Operating at a lower supply voltage of 3.3V results in lower power consumption and may be compatible with a wide range of systems.

Propagation Delay: 4.6 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial environments with varying temperature conditions.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor configuration provides improved signal integrity and noise immunity, enhancing the reliability of the product.

Minimum Supply Voltage: 2.7V

The ability to operate at a minimum supply voltage of 2.7V allows for flexibility in power source requirements and compatibility with different systems.

Technology: BICMOS

Utilizing Bipolar CMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption in one package.

Technical Specifications

Bus Driver & Transceivers SN74LVTH162245DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74LVTH162245DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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