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SN74LVTH125DB

Texas Instruments

SN74LVTH125DB by Texas Instruments

SN74LVTH125DB by Texas Instruments is a 4-function bus driver with 3-STATE output, operating at a supply voltage range of 2.7V to 3.6V. It features a propagation delay of 4.9ns and can withstand industrial temperatures from -40°C to 85°C. Ideal for applications requiring fast signal transmission in compact spaces due to its small outline package style.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,320 parts In-Stock

1+ parts

-

100+ parts

$0.503

1k+ parts

$0.418

10k+ parts

$0.372

18,320

-

$0.503

$0.418

$0.372

Verical

USA . 18,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.522

10k+ parts

$0.466

18,320

-

-

$0.522

$0.466

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,621 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

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3,621

$0.391

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-

-

Vyrian

USA . 7,774 parts In-Stock

1+ parts

-

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7,774

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 47 parts In-Stock

1+ parts

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47

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NPI Materials, Inc.

USA . 45 parts In-Stock

1+ parts

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45

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,305 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

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4,305

$0.371

-

-

-

Component Stockers USA

USA . 23,598 parts In-Stock

1+ parts

$0.420

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

$0.360

23,598

$0.420

$0.400

$0.360

$0.360

AZTECH Wire

Italy . 912 parts In-Stock

1+ parts

$13.080

100+ parts

-

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912

$13.080

-

-

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Parana Technologies

USA . 1,981 parts In-Stock

1+ parts

$29.027

100+ parts

-

1k+ parts

$54.559

10k+ parts

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1,981

$29.027

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$54.559

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DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$31.963

100+ parts

-

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17

$31.963

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ChromeModa Solutions

Germany . 6,004 parts In-Stock

1+ parts

$32.615

100+ parts

$26.744

1k+ parts

-

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6,004

$32.615

$26.744

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$32.615

100+ parts

$30.984

1k+ parts

$29.354

10k+ parts

-

1,711

$32.615

$30.984

$29.354

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Andel Nordic

Denmark . 2,833 parts In-Stock

1+ parts

$50.998

100+ parts

-

1k+ parts

$48.959

10k+ parts

$48.959

2,833

$50.998

-

$48.959

$48.959

Microchip USA

USA . 12,946 parts In-Stock

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12,946

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Overview

Elevate your electronic designs with the SN74LVTH125DB by Texas Instruments, a high-quality Bus Driver & Transceiver that offers unmatched performance and reliability. With a compact design and advanced technology, this product provides seamless connectivity and control for your applications. Whether you're working on IoT devices, robotics, or communication systems, this versatile component delivers the value, benefits, and advantages you need to bring your projects to life. Trust in Texas Instruments for superior engineering and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy material provides good electrical insulation and protection, making the product durable and reliable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Provides multiple functions in a single component, offering versatility and cost-effectiveness.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 4.9 ns

Low propagation delay ensures fast signal transmission, ideal for high-speed data communication.

Maximum Operating Temperature: 85 °C

Designed to withstand high temperatures, suitable for industrial and automotive applications.

Output Characteristics: 3-STATE

3-state output allows for tristate operation, enabling multiple bus drivers to be connected in parallel.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, making it suitable for harsh environments.

Maximum Seated Height: 2 mm

Low profile design saves space on the circuit board, ideal for compact electronic devices.

Width: 5.3 mm

Compact width allows for efficient use of board space, enabling dense PCB layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, preventing errors in data communication.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments.

Technology: BICMOS

Utilizes BiCMOS technology for a blend of high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74LVTH125DB attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.9 ns

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LVTH125DB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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