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SN74LVCHR32245AKR

Texas Instruments

SN74LVCHR32245AKR by Texas Instruments

Texas Instruments SN74LVCHR32245AKR is an 8-bit bus driver with 4 functions, featuring a propagation delay of 4.8 ns and operating voltage of 1.8V to 3.3V. Ideal for bidirectional applications in industrial settings, it offers a low profile grid array package with a terminal pitch of 0.8mm and max seated height of 1.4mm.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,159 parts In-Stock

1+ parts

-

100+ parts

$2.370

1k+ parts

$2.120

10k+ parts

$1.990

3,159

-

$2.370

$2.120

$1.990

Verical

USA . 1,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.650

10k+ parts

$2.487

1,209

-

-

$2.650

$2.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 4,502 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

4,502

$1.850

-

-

-

DF Sales Co.

USA . 4,502 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

4,502

$1.850

-

-

-

Digiode

USA . 343 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$2.498

-

-

-

Vyrian

USA . 4,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,910

-

-

-

-

DigiKey Marketplace

USA . 3,209 parts In-Stock

1+ parts

-

100+ parts

$2.740

1k+ parts

-

10k+ parts

-

3,209

-

$2.740

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,090 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

$2.240

-

-

-

Corphita

USA . 2,930 parts In-Stock

1+ parts

$2.367

100+ parts

-

1k+ parts

-

10k+ parts

-

2,930

$2.367

-

-

-

Parana Technologies

USA . 2,048 parts In-Stock

1+ parts

$11.687

100+ parts

-

1k+ parts

$12.077

10k+ parts

-

2,048

$11.687

-

$12.077

-

DigiPath Technology Company

USA . 810 parts In-Stock

1+ parts

$12.868

100+ parts

$11.839

1k+ parts

-

10k+ parts

-

810

$12.868

$11.839

-

-

ChromeModa Solutions

Germany . 5,399 parts In-Stock

1+ parts

$13.131

100+ parts

$10.767

1k+ parts

-

10k+ parts

-

5,399

$13.131

$10.767

-

-

IDEA Electronic Components Group

UK . 1,144 parts In-Stock

1+ parts

$13.131

100+ parts

$12.474

1k+ parts

$11.818

10k+ parts

-

1,144

$13.131

$12.474

$11.818

-

Perfect Parts

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,081

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Microchip USA

USA . 417 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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417

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-

Overview

Enhance your electronic designs with the SN74LVCHR32245AKR by Texas Instruments, a top-tier manufacturer known for its high-quality products. As a versatile Bus Driver & Transceiver, this component offers 4 functions in a compact rectangular package, making it ideal for various applications. With a low propagation delay and 3-state output characteristics, this product ensures efficient signal transmission. Experience the value of reliable performance and seamless integration with the SN74LVCHR32245AKR, setting your projects up for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Propagation Delay At Nominal Supply: 4.8 ns

Ensures fast signal processing and efficient communication within the bus system.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional parts.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low voltage, saving energy and reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74LVCHR32245AKR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVCHR32245AKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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