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SN74LVCH16652ADLG4

Texas Instruments

SN74LVCH16652ADLG4 by Texas Instruments

SN74LVCH16652ADLG4 by Texas Instruments is a bus driver with 8 bits, 2 functions, and 3-STATE output. It operates at a supply voltage of 1.8V to 3.6V, has a propagation delay of 7.3ns, and can handle up to 24A of current. Ideal for automotive applications due to its small size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,636 parts In-Stock

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Digiode

USA . 2,963 parts In-Stock

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2,963

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Distributors (Availability)

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AZTECH Wire

Italy . 609 parts In-Stock

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$6.825

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609

$6.825

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One Stop Electronics

USA . 1,260 parts In-Stock

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$10.000

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$10.000

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Parana Technologies

USA . 1,377 parts In-Stock

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$20.926

100+ parts

$1,943.267

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$18.833

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1,377

$20.926

$1,943.267

$18.833

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DigiPath Technology Company

USA . 1,881 parts In-Stock

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$23.042

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$21.198

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1,881

$23.042

$21.198

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ChromeModa Solutions

Germany . 5,150 parts In-Stock

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$23.512

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$19.280

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$23.512

$19.280

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IDEA Electronic Components Group

UK . 216 parts In-Stock

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$23.512

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$22.336

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$21.161

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216

$23.512

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$21.161

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Andel Nordic

Denmark . 3,999 parts In-Stock

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Microchip USA

USA . 1,568 parts In-Stock

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Corphita

USA . 72 parts In-Stock

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Overview

Enhance the performance of your electronic projects with the SN74LVCH16652ADLG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers high-quality bus drivers & transceivers that cater to a wide range of applications. With a 3-STATE output, true output polarity, and independent control, this versatile component ensures seamless operation while providing reliable results. Trust in Texas Instruments for innovative technology that exceeds expectations and enhances the functionality of your designs. Elevate your projects with the SN74LVCH16652ADLG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and reliability to the product.

Propagation Delay At Nominal Supply: 6.3 ns

With a low propagation delay, this product ensures fast and efficient data transmission.

Surface Mount: YES

The surface mount feature makes it easy to integrate this product onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for various applications.

Output Characteristics: 3-STATE

The 3-state output allows for versatile data transmission control, giving flexibility in the design of the bus system.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16652ADLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVCH16652ADLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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