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SN74LVCH16245AGQLR

Texas Instruments

SN74LVCH16245AGQLR by Texas Instruments

SN74LVCH16245AGQLR by Texas Instruments is an 8-bit bus driver with 2 functions, operating at a supply voltage of 1.8V to 3.6V. It features a propagation delay of 4ns, output polarity TRUE, and supports load capacitance up to 50pF. Ideal for industrial applications requiring bidirectional control in compact spaces due to its very thin profile and fine pitch grid array package style.

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,066 parts In-Stock

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Digiode

USA . 3,516 parts In-Stock

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Microfarads

USA . 1,462 parts In-Stock

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Bristol Electronics

USA . 930 parts In-Stock

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$1.500

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$0.792

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M&R Communications

USA . 452 parts In-Stock

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Atlantic Semiconductor

USA . 200 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Andel Nordic

Denmark . 1,775 parts In-Stock

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$3.695

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$3.547

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$3.547

1,775

$3.695

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$3.547

AZTECH Wire

Italy . 808 parts In-Stock

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$8.245

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808

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Parana Technologies

USA . 1,364 parts In-Stock

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$28.451

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$47.665

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One Stop Electronics

USA . 1,047 parts In-Stock

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$31.000

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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IDEA Electronic Components Group

UK . 2,256 parts In-Stock

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$31.967

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$30.369

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$28.770

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ChromeModa Solutions

Germany . 2,223 parts In-Stock

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$31.967

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronics projects with the SN74LVCH16245AGQLR from Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a Bus Driver & Transceiver, this product is versatile, offering 8 bits of data transmission with a fast propagation delay of 4 ns. With a low nominal supply voltage of 1.8V and 3.3V power supplies, it provides efficient operation while maintaining a compact design. Ideal for industrial applications, this component's exceptional performance, 3-STATE output characteristics, and bidirectional count direction make it a valuable addition to any circuit design. Upgrade your projects today with the SN74LVCH16245AGQLR and experience the difference in quality and functionality that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making the product efficient and reliable in data communication.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one device increases versatility and reduces the need for additional components, making the product cost-effective.

Package Shape: RECTANGULAR

Rectangular package shape is commonly utilized and easy to handle during installation, ensuring compatibility with standard PCB layouts.

No. of Bits: 8

8-bit resolution provides sufficient data processing capabilities, suitable for a wide range of applications requiring moderate data complexity.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V results in lower power consumption and reduced heat generation, enhancing energy efficiency.

Load Capacitance (CL): 50 pF

The load capacitance of 50pF ensures stable signal transmission and reception, maintaining signal integrity in high-speed data communication.

Power Supplies (V): 3.3

Compatible with standard power supplies operating at 3.3V, making it easy to integrate into existing systems without requiring additional voltage regulators.

No. of Terminals: 56

Having a high number of terminals provides flexibility in connectivity options, allowing for various input/output configurations to meet specific system requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables high-density mounting on PCBs, maximizing component placement efficiency.

Maximum I (ol): 24 Amp

High output current capacity of 24A allows for driving multiple loads without the need for external amplification, minimizing additional circuitry.

Propagation Delay (tpd): 7.1 ns

Low propagation delay of 7.1ns ensures fast response time, critical for applications requiring real-time data processing and communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85°C ensures reliability and stability in harsh environmental conditions, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus sharing and reducing bus contention issues in multi-driver communication systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can withstand extreme cold environments, ensuring consistent performance in various conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections for long-term use.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to interface with other components on the board.

No. of Ports: 2

Having multiple ports allows for simultaneous data transfer between different devices, increasing connectivity options and system flexibility.

Maximum Seated Height: 1 mm

Low seated height of 1mm minimizes the overall profile of the component, enabling compact design and reducing PCB space requirements.

Width: 4.5 mm

Narrow width of 4.5mm saves space on the PCB, enabling efficient component placement and allowing for compact system design.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, eliminating confusion in signal interpretation and improving overall system reliability.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage of 1.65V allows for reliable operation even in low-power scenarios, making the product suitable for portable and battery-operated devices.

Peak Reflow Temperature °C: 240

High peak reflow temperature of 240°C ensures proper soldering during assembly, preventing solder joint failure and ensuring long-term reliability.

Length: 7 mm

Compact length of 7mm optimizes PCB space utilization, facilitating efficient layout design and allowing for high component density in compact systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in demanding operating conditions, suitable for rugged industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form provides reliable solder connections and high mechanical strength, ensuring stable electrical connections and robust performance in demanding environments.

Packing Method: TR

TR packing method (tape and reel) facilitates automated pick-and-place assembly, streamlining production processes and reducing assembly time and cost.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting on the PCB, allowing for compact design and efficient use of available board space.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for data transfer in both directions, enhancing communication flexibility and enabling versatile system integration.

Control Type: COMMON CONTROL

Common control type simplifies system operation and coordination, allowing for centralized control of multiple functions and devices for efficient data management.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage of 3.6V ensures compatibility with various power sources, offering flexibility in system design and operation for diverse applications.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16245AGQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e0

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Translation:

N/A

Width:

4.5 mm

Trade Compliance

SN74LVCH16245AGQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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