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SN74LVC374AQPWRQ1

Texas Instruments

SN74LVC374AQPWRQ1 by Texas Instruments

Texas Instruments SN74LVC374AQPWRQ1 is an 8-bit bus driver with 3-STATE output. It operates at a max frequency of 100MHz, with propagation delay of 9.5ns and load capacitance of 50pF. Ideal for automotive applications due to AEC-Q100 screening and operating temperature range from -40°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,893 parts In-Stock

1+ parts

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3,893

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Vyrian

USA . 2,365 parts In-Stock

1+ parts

-

100+ parts

-

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2,365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,166 parts In-Stock

1+ parts

$4.157

100+ parts

-

1k+ parts

$3.991

10k+ parts

$3.991

2,166

$4.157

-

$3.991

$3.991

AZTECH Wire

Italy . 721 parts In-Stock

1+ parts

$8.864

100+ parts

-

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721

$8.864

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Parana Technologies

USA . 1,984 parts In-Stock

1+ parts

$13.022

100+ parts

-

1k+ parts

$13.519

10k+ parts

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1,984

$13.022

-

$13.519

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ChromeModa Solutions

Germany . 3,219 parts In-Stock

1+ parts

$14.632

100+ parts

$11.998

1k+ parts

-

10k+ parts

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3,219

$14.632

$11.998

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$14.632

100+ parts

$13.900

1k+ parts

$13.169

10k+ parts

-

1,547

$14.632

$13.900

$13.169

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One Stop Electronics

USA . 532 parts In-Stock

1+ parts

$44.000

100+ parts

-

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532

$44.000

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Corphita

USA . 2,145 parts In-Stock

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2,145

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DigiPath Technology Company

USA . 1,476 parts In-Stock

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100+ parts

$13.192

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1,476

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$13.192

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Microchip USA

USA . 318 parts In-Stock

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-

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318

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Overview

Enhance the performance of your automotive electronics with the SN74LVC374AQPWRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver and transceiver is designed to streamline communication processes in automotive applications, offering fast propagation delays and 3-state output characteristics. With its compact size and wide operating temperature range, this product ensures seamless integration into your systems. Trust Texas Instruments to deliver cutting-edge technology that brings value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications where weight and durability are important factors.

Propagation Delay At Nominal Supply - 8.5 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication in bus driver and transceiver applications.

Surface Mount - YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and making assembly process more streamlined.

Screening Level - AEC-Q100

Compliance with AEC-Q100 automotive quality standard ensures reliability and robustness in harsh automotive environments, making this product a dependable choice for automotive applications.

Package Shape - RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts, making integration into existing designs easier.

Technical Specifications

Bus Driver & Transceivers SN74LVC374AQPWRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LVC374AQPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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