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SN74LVC2G32DCUTE4

Texas Instruments

SN74LVC2G32DCUTE4 by Texas Instruments

SN74LVC2G32DCUTE4 by Texas Instruments is a logic gate with 2 functions and inputs, offering a propagation delay of 3.8 ns at 1.8V supply voltage. It has a small outline package style suitable for industrial applications requiring fast signal processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 68,530 parts In-Stock

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Vyrian

USA . 8,225 parts In-Stock

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8,225

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Digiode

USA . 2,731 parts In-Stock

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2,731

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Distributors (Availability)

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Ampacity Inc.

Singapore . 465 parts In-Stock

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$4.000

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465

$4.000

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AZTECH Wire

Italy . 656 parts In-Stock

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$10.021

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Parana Technologies

USA . 1,315 parts In-Stock

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$24.446

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$25.114

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$24.446

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$25.114

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DigiPath Technology Company

USA . 712 parts In-Stock

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$26.918

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712

$26.918

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ChromeModa Solutions

Germany . 6,408 parts In-Stock

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$27.467

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$22.523

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$27.467

$22.523

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

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$27.467

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$26.094

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$24.720

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1,682

$27.467

$26.094

$24.720

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Semicontronic

India . 889 parts In-Stock

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$55.000

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$53.625

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$53.350

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889

$55.000

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$53.350

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One Stop Electronics

USA . 203 parts In-Stock

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$64.000

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Corphita

USA . 2,457 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,733 parts In-Stock

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Argo Parts USA

USA . 1,500 parts In-Stock

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Microchip USA

USA . 341 parts In-Stock

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341

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Overview

Enhance your electronic projects with the SN74LVC2G32DCUTE4 by Texas Instruments. This high-quality logic gate offers fast propagation delay, low power consumption, and 3-state output characteristics, making it ideal for a wide range of applications. With Texas Instruments' reputation for reliability and innovation, you can trust that this product will deliver superior performance and durability. Upgrade your designs today and experience the value and benefits that this versatile component brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good durability for the product.

Propagation Delay At Nominal Supply: 3.8 ns

The low propagation delay ensures high-speed operation of the logic gates.

Surface Mount: YES

Surface mount feature makes it easy to integrate into compact circuit designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement allows for efficient power consumption.

Output Characteristics: 3-STATE

3-STATE output feature provides flexibility in controlling the output signal.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for various environments.

Technical Specifications

Logic Gates SN74LVC2G32DCUTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN74LVC2G32DCUTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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