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SN74LVC2G240YEPR

Texas Instruments

SN74LVC2G240YEPR by Texas Instruments

SN74LVC2G240YEPR by Texas Instruments is a 2-function bus driver with 4.6ns propagation delay at 1.8V, suitable for industrial applications. It features a max I (ol) of 24A, operates b/w -40 to 85°C, and has a package style of GRID ARRAY with very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,524 parts In-Stock

1+ parts

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7,524

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Digiode

USA . 2,454 parts In-Stock

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2,454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$14.165

100+ parts

-

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530

$14.165

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Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

$26.955

100+ parts

$2,503.221

1k+ parts

$24.260

10k+ parts

-

1,386

$26.955

$2,503.221

$24.260

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DigiPath Technology Company

USA . 2,317 parts In-Stock

1+ parts

$29.681

100+ parts

$27.307

1k+ parts

-

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2,317

$29.681

$27.307

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ChromeModa Solutions

Germany . 5,291 parts In-Stock

1+ parts

$30.287

100+ parts

$24.835

1k+ parts

-

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5,291

$30.287

$24.835

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IDEA Electronic Components Group

UK . 1,069 parts In-Stock

1+ parts

$30.287

100+ parts

$28.773

1k+ parts

$27.258

10k+ parts

-

1,069

$30.287

$28.773

$27.258

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Andel Nordic

Denmark . 776 parts In-Stock

1+ parts

$33.245

100+ parts

-

1k+ parts

$31.915

10k+ parts

$31.915

776

$33.245

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$31.915

$31.915

One Stop Electronics

USA . 1,571 parts In-Stock

1+ parts

$63.000

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1,571

$63.000

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Corphita

USA . 1,036 parts In-Stock

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1,036

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Microchip USA

USA . 221 parts In-Stock

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221

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Overview

Enhance your electronic projects with the SN74LVC2G240YEPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This bus driver and transceiver is a versatile component with a wide range of applications, delivering fast propagation delay and low power consumption. With its compact package and high performance, this product offers great value to customers, providing seamless operation and optimal functionality for your designs. Upgrade your projects today with Texas Instruments' superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 4.6 ns

With low propagation delay, this product ensures fast and efficient data transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V, this product offers energy efficiency and is well-suited for battery-powered devices.

Output Characteristics: 3-STATE

The 3-STATE output feature provides flexibility in controlling the output signal, making it versatile for different circuit configurations and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable and efficient choice.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G240YEPR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B8

Length:

1.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC2G240YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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