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SN74LVC16T245ZQLR

Texas Instruments

SN74LVC16T245ZQLR by Texas Instruments

SN74LVC16T245ZQLR by Texas Instruments is a bus driver & transceiver with 8-bit capacity, operating at 1.8V nominal voltage. It features a propagation delay of 23.8ns and supports translation b/w 1.8V and 5V power supplies. Ideal for industrial applications requiring bidirectional control with a max operating temperature of 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,367 parts In-Stock

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5,367

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Digiode

USA . 1,660 parts In-Stock

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1,660

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Nova Conductors

Japan . 870 parts In-Stock

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870

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LWI Electronics Inc

India . 18 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 870 parts In-Stock

1+ parts

$7.000

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870

$7.000

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Andel Nordic

Denmark . 1,527 parts In-Stock

1+ parts

$7.868

100+ parts

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$7.553

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$7.553

1,527

$7.868

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$7.553

$7.553

Parana Technologies

USA . 117 parts In-Stock

1+ parts

$7.956

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$8.527

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117

$7.956

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$8.527

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DigiPath Technology Company

USA . 635 parts In-Stock

1+ parts

$8.760

100+ parts

$8.059

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635

$8.760

$8.059

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IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$8.939

100+ parts

$8.492

1k+ parts

$8.045

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2,140

$8.939

$8.492

$8.045

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ChromeModa Solutions

Germany . 114 parts In-Stock

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$8.939

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$7.330

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114

$8.939

$7.330

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AZTECH Wire

Italy . 47 parts In-Stock

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$14.763

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47

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$56.000

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Perfect Parts

USA . 15,032 parts In-Stock

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Argo Parts USA

USA . 3,475 parts In-Stock

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Corphita

USA . 2,513 parts In-Stock

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2,513

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Continental Prestige Electronics

USA . 1,943 parts In-Stock

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1,943

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

USA . 494 parts In-Stock

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494

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Overview

Experience seamless data transmission and reliable performance with the SN74LVC16T245ZQLR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and innovation. Ideal for bus drivers and transceivers, this product offers efficient signal translation and versatile applications. Whether you're in need of bidirectional communication or common control, this device provides exceptional value with its quick propagation delay and wide voltage range. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the bus driver and transceivers.

Propagation Delay At Nominal Supply: 23.8 ns

Low propagation delay ensures fast and efficient data transmission in the bus system.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on a PCB, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single device enhances the functionality and versatility of the bus driver and transceivers.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into the overall design of the bus system.

No. of Bits: 8

8-bit data transmission capability provides sufficient capacity for handling data in bus communication.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a nominal supply voltage of 1.8V, suitable for low power applications.

Load Capacitance (CL): 15 pF

The low load capacitance helps in minimizing signal distortion and maintaining signal integrity in the bus system.

Power Supplies (V): 1.8/5

Supports dual power supplies at 1.8V and 5V, providing flexibility for different system requirements.

No. of Terminals: 56

Having a high number of terminals allows for multiple connections and ensures robust connectivity.

Technical Specifications

Bus Driver & Transceivers SN74LVC16T245ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

23.8 ns

Propagation Delay (tpd):

23.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5V&1.8/5V

Width:

4.5 mm

Trade Compliance

SN74LVC16T245ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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