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SN74LVC16646ADLRG4

Texas Instruments

SN74LVC16646ADLRG4 by Texas Instruments

SN74LVC16646ADLRG4 by Texas Instruments is a bus driver with 8 bits, 2 functions, and 3-STATE output. It operates at a supply voltage of 1.8V to 3.6V, with a propagation delay of 5.2 ns and max I (ol) of 24 Amp. Ideal for bidirectional data transmission in industrial applications due to its positive edge trigger and independent control features.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 5,983 parts In-Stock

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Digiode

USA . 4,150 parts In-Stock

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Andel Nordic

Denmark . 628 parts In-Stock

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$7.849

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$7.535

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$7.535

628

$7.849

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$7.535

AZTECH Wire

Italy . 453 parts In-Stock

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$11.470

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One Stop Electronics

USA . 1,294 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,828 parts In-Stock

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$23.624

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IDEA Electronic Components Group

UK . 2,335 parts In-Stock

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$25.813

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$24.522

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$23.232

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$25.813

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$23.232

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ChromeModa Solutions

Germany . 1,248 parts In-Stock

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$25.813

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$21.167

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Microchip USA

USA . 4,980 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 69 parts In-Stock

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$23.273

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Overview

Unlock seamless data transmission and enhance your electronics projects with the SN74LVC16646ADLRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus driver & transceivers that guarantee reliability and efficiency. With 8 bits and 2 functions, this product offers fast propagation delay at nominal supply, making it ideal for a wide range of applications. Experience the value of true output polarity, independent control, and 3-state output characteristics, all in a compact package that ensures optimal performance. Elevate your designs with the SN74LVC16646ADLRG4 and experience unmatched precision and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 5.2 ns

Ensures fast and efficient signal transmission.

Surface Mount: YES

Allows for easy installation onto circuit boards.

No. of Functions: 2

Provides versatility in operation.

Package Shape: RECTANGULAR

Space-efficient design for tight layouts.

No. of Bits: 8

Offers a sufficient range of operational possibilities.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal voltage for efficient performance.

Power Supplies (V): 3.3

Compatible with standard power sources.

No. of Terminals: 56

Plenty of connectivity options for various configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design for space-saving installations.

Maximum I (ol): 24 Amp

Capable of handling high current loads.

Propagation Delay (tpd): 12.4 ns

Low delay for quick signal processing.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperatures.

Output Characteristics: 3-STATE

Allows for high flexibility in controlling outputs.

Trigger Type: POSITIVE EDGE

Precise triggering for accurate data transmission.

Minimum Operating Temperature: -40 °C

Wide temperature range for versatile use cases.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for long-lasting connections.

Terminal Position: DUAL

Ensures stability and reliability in connections.

No. of Ports: 2

Multiple ports for enhanced connectivity options.

Maximum Seated Height: 2.79 mm

Low profile design for compact installations.

Width: 7.49 mm

Space-efficient dimensions for fitting in tight spaces.

Output Polarity: TRUE

Accurate output polarity for precise control.

Minimum Supply Voltage (Vsup): 1.65 V

Allows for operation at lower voltages for efficiency.

Peak Reflow Temperature °C: 260

High-temperature tolerance for manufacturing processes.

Length: 18.415 mm

Optimal length for versatile installation options.

Temperature Grade: INDUSTRIAL

Meets industrial standards for robust operation.

Technology: CMOS

Utilizes CMOS technology for efficient performance.

Terminal Form: GULL WING

Secure terminal design for reliable connections.

Packing Method: TR

Efficient packing method for safe transportation and storage.

Terminal Pitch: 0.635 mm

Fine pitch terminals for compact designs.

Count Direction: BIDIRECTIONAL

Allows for data transmission in both directions.

Control Type: INDEPENDENT CONTROL

Independently control functions for customized operations.

Maximum Supply Voltage (Vsup): 3.6 V

Wide voltage range for compatibility with various systems.

Maximum Power Supply Current (ICC): 0.02 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74LVC16646ADLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

12.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVC16646ADLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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