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SN74LVC125ARGYRG4

Texas Instruments

SN74LVC125ARGYRG4 by Texas Instruments

SN74LVC125ARGYRG4 by Texas Instruments is a 4-bit bus driver & transceiver with a propagation delay of 4.8 ns and a nominal voltage of 1.8V. It is commonly used in automotive applications due to its low power consumption and high temperature tolerance (up to 125°C).

Median Price

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3

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1k+

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Digiode

USA . 1,287 parts In-Stock

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Vyrian

USA . 1,021 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Andel Nordic

Denmark . 2,439 parts In-Stock

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$9.910

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$9.514

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$9.514

2,439

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AZTECH Wire

Italy . 703 parts In-Stock

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$16.951

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Parana Technologies

USA . 835 parts In-Stock

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$26.427

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DigiPath Technology Company

USA . 2,205 parts In-Stock

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$28.437

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$26.162

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ChromeModa Solutions

Germany . 4,240 parts In-Stock

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$29.017

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$23.794

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IDEA Electronic Components Group

UK . 149 parts In-Stock

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$29.017

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$27.566

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$26.115

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One Stop Electronics

USA . 275 parts In-Stock

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Ampacity Inc.

Singapore . 1,567 parts In-Stock

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Continental Prestige Electronics

USA . 6,671 parts In-Stock

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Argo Parts USA

USA . 3,520 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,465 parts In-Stock

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Corphita

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Microchip USA

USA . 1,865 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SN74LVC125ARGYRG4. As a leading manufacturer in the industry, Texas Instruments delivers innovative solutions for bus drivers and transceivers. The SN74LVC125ARGYRG4 offers exceptional value, benefits, and advantages to customers. With its advanced features and cutting-edge technology, this product ensures fast propagation delay, 3-state output characteristics, and true output polarity. Suitable for automotive applications, this compact and versatile chip carrier offers the perfect solution for your needs. Trust Texas Instruments for superior performance and unparalleled excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to rough handling, making this product a reliable choice for bus drivers and transceivers in various environments.

Propagation Delay At Nominal Supply: 4.8 ns

With a fast propagation delay at the nominal supply voltage, this product enables efficient and speedy transmission of data, enhancing the overall performance and response time.

Surface Mount: YES

The surface mount capability of this product allows for easy and convenient installation on circuit boards, reducing the assembly time and effort required, making it a highly practical choice.

No. of Functions: 4

With four different functions integrated into one device, this product offers versatility and reduces the need for multiple components, saving both space and cost, making it an efficient and economical choice.

Package Shape: SQUARE

The square package shape of this product provides stability and ease of mounting, ensuring a secure fit within electronic systems, enabling reliable operation even in vibrating conditions, making it an ideal choice for bus drivers and transceivers.

No. of Bits: 1

Featuring one bit, this product is suitable for applications that only require binary signals, allowing for simplified and straightforward data processing, making it an ideal choice for specific use cases.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage, this product offers energy efficiency, reducing power consumption and extending battery life, making it a suitable choice for power-sensitive applications.

Power Supplies (V): 3.3

Supporting a power supply voltage of 3.3V, this product can operate reliably with commonly available power sources, ensuring compatibility and ease of integration, making it a convenient choice for various systems.

No. of Terminals: 14

This product features 14 terminals, providing ample connectivity options and compatibility with different circuit designs, making it a versatile choice for bus driver and transceiver applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with a heat sink/slug and very thin profile enables efficient heat dissipation and space-saving installation, ensuring reliable performance even in compact systems, making it a suitable choice for limited-space applications.

Maximum I (ol): 24 Amp

With a high maximum output current capacity of 24 Amps, this product can handle demanding load requirements, ensuring reliable operation under heavy loads, making it a robust choice for demanding bus driver and transceiver applications.

Propagation Delay (tpd): 12.3 ns

Featuring a propagation delay of 12.3 ns, this product ensures fast and efficient signal transmission, reducing signal latency and enabling real-time communication, making it an ideal choice for high-speed data applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand elevated temperatures, ensuring reliable operation even in harsh environments, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristic of this product allows for tri-state operation, enabling efficient bus sharing and reducing conflicts in multi-driver applications, making it a flexible and compatible choice.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this product can withstand extreme cold conditions, ensuring reliable performance in various temperature environments, making it suitable for outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish with nickel palladium gold provides excellent corrosion resistance and stable electrical contact, ensuring long-lasting performance and reducing maintenance requirements, making it a reliable choice for long-term use.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection, facilitating efficient PCB assembly and reducing production time, making it a convenient choice for manufacturers and assemblers.

No. of Ports: 2

Featuring two ports, this product offers enhanced connectivity options, allowing for simultaneous data transmission or multiple device connections, making it a versatile choice for various bus driver and transceiver applications.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1 mm, this product minimizes the overall height of the assembly, enabling compact system designs and increasing flexibility in product integration, making it suitable for space-constrained applications.

Width: 3.5 mm

With a narrow width of 3.5 mm, this product provides space-saving options for circuit board layout, enabling high-density packing and efficient use of PCB space, making it a suitable choice for compact systems.

Output Polarity: TRUE

The output polarity set as "TRUE" ensures compatibility and ease of integration with various system architectures, reducing the need for additional circuitry, making it a convenient choice for streamlined designs.

Minimum Supply Voltage (Vsup): 1.65 V

With a low minimum supply voltage requirement of 1.65V, this product can operate efficiently even with lower power sources, enhancing energy efficiency and expanding potential applications, making it a flexible choice for various systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering during assembly processes, reducing the risk of component damage, making it a reliable choice for manufacturing operations.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260°C, this product allows for high-temperature soldering, ensuring secure and durable connections during manufacturing processes, making it suitable for robust and reliable assembly.

Length: 3.5 mm

With a compact length of 3.5 mm, this product offers flexibility in PCB layout and system design, enabling space-efficient integration, making it a suitable choice for small and lightweight bus driver and transceiver applications.

Temperature Grade: AUTOMOTIVE

Designed with an automotive-grade temperature range, this product can reliably operate in extreme temperature conditions commonly encountered in automotive environments, making it an optimal choice for automotive bus driver and transceiver applications.

Technology: CMOS

Utilizing CMOS technology, this product ensures low power consumption and provides high noise immunity, enhancing integration compatibility and optimizing performance, making it an efficient and reliable choice for bus driver and transceiver applications.

Terminal Form: NO LEAD

With a no-lead terminal form, this product complies with RoHS standards, ensuring environmental friendliness and facilitating lead-free soldering processes, making it a sustainable choice for eco-conscious applications.

Packing Method: TR

The product is packed in Tape and Reel (TR) format, facilitating automated assembly processes, reducing handling time, and ensuring convenience in mass production, making it a preferred choice for efficient manufacturing operations.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, this product supports high-density packaging, allowing for miniaturization and increased circuit complexity, making it suitable for space-constrained applications.

Count Direction: UNIDIRECTIONAL

Featuring a unidirectional count direction, this product provides consistency and reliability in data transmission, ensuring accurate counting and reducing errors, making it an ideal choice for applications requiring precise counting operations.

Control Type: ENABLE LOW

The control type "ENABLE LOW" simplifies the integration and operation of this product by utilizing a straightforward control signal, eliminating the need for complex control circuits, making it a user-friendly choice for varied applications.

Moisture Sensitivity Level (MSL): 2

With an MSL rating of 2, this product exhibits moderate moisture sensitivity, requiring standard precautions during storage and assembly, ensuring product integrity and reliability, making it a dependable choice for manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage of 3.6V, this product offers compatibility with a wide range of power sources, accommodating different system requirements, making it a versatile choice for various bus driver and transceiver applications.

Maximum Power Supply Current (ICC): 0.04 mA

The low maximum power supply current requirement of 0.04 mA ensures energy efficiency and reduces power consumption, making this product suitable for low-power applications and extending battery life.

Technical Specifications

Bus Driver & Transceivers SN74LVC125ARGYRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3.5 mm

Trade Compliance

SN74LVC125ARGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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