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SN74LVC06ARGYRG4

Texas Instruments

SN74LVC06ARGYRG4 by Texas Instruments

SN74LVC06ARGYRG4 by Texas Instruments is a CMOS Logic Gates chip with 6 functions, 3.7 ns propagation delay, and open-drain output. It operates at 1.8V to 3.6V for automotive applications, featuring a compact square package with very thin profile and nickel palladium gold finish suitable for surface mount assembly.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 933 parts In-Stock

1+ parts

$1.100

100+ parts

$0.413

1k+ parts

$0.277

10k+ parts

$0.181

933

$1.100

$0.413

$0.277

$0.181

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.210

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.210

-

-

-

Digiode

USA . 2,213 parts In-Stock

1+ parts

$0.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213

$0.408

-

-

-

Vyrian

USA . 5,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,361

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,490 parts In-Stock

1+ parts

$0.387

100+ parts

-

1k+ parts

-

10k+ parts

-

4,490

$0.387

-

-

-

Parana Technologies

USA . 455 parts In-Stock

1+ parts

$22.101

100+ parts

-

1k+ parts

$22.700

10k+ parts

-

455

$22.101

-

$22.700

-

DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$24.336

100+ parts

$22.389

1k+ parts

-

10k+ parts

-

221

$24.336

$22.389

-

-

ChromeModa Solutions

Germany . 2,560 parts In-Stock

1+ parts

$24.833

100+ parts

$20.363

1k+ parts

-

10k+ parts

-

2,560

$24.833

$20.363

-

-

IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$24.833

100+ parts

$23.591

1k+ parts

$22.350

10k+ parts

-

318

$24.833

$23.591

$22.350

-

Microchip USA

USA . 2,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,941

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Overview

Elevate your projects with the SN74LVC06ARGYRG4 logic gates by Texas Instruments, a trusted manufacturer known for top-quality components. Ideal for a variety of applications, these logic gates offer fast propagation delay and low power consumption, making them a reliable choice for your designs. With a compact package design and wide temperature range, this product provides exceptional value and performance for your electronic projects. Upgrade to Texas Instruments for superior quality and reliability in your circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Propagation Delay At Nominal Supply: 3.7 ns

Low propagation delay ensures fast processing and high efficiency in signal transmission.

No. of Functions: 6

Having 6 functions in one package increases integration and reduces overall system complexity.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low nominal supply voltage of 1.8V, leading to power savings.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for automotive and industrial applications.

Technical Specifications

Logic Gates SN74LVC06ARGYRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

SN74LVC06ARGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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