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SN74LVC02APWTG4

Texas Instruments

SN74LVC02APWTG4 by Texas Instruments

SN74LVC02APWTG4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 1.8V and has a propagation delay of 5.5ns, making it suitable for automotive applications due to its temperature grade and small form factor.

Median Price

$0.484

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$0.484

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91

$0.484

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Chip Stock

USA . 26,170 parts In-Stock

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26,170

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Digiode

USA . 3,252 parts In-Stock

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3,252

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Vyrian

USA . 2,783 parts In-Stock

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2,783

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Distributors (Availability)

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Parana Technologies

USA . 1,393 parts In-Stock

1+ parts

$8.581

100+ parts

-

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$9.242

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1,393

$8.581

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$9.242

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DigiPath Technology Company

USA . 1,856 parts In-Stock

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$9.449

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1,856

$9.449

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ChromeModa Solutions

Germany . 3,992 parts In-Stock

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$9.642

100+ parts

$7.906

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3,992

$9.642

$7.906

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IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$9.642

100+ parts

$9.160

1k+ parts

$8.678

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-

749

$9.642

$9.160

$8.678

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AZTECH Wire

Italy . 332 parts In-Stock

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$13.757

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332

$13.757

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Ampacity Inc.

Singapore . 468 parts In-Stock

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$43.000

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468

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One Stop Electronics

USA . 1,160 parts In-Stock

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$45.000

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Component Stockers USA

USA . 673 parts In-Stock

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$99.990

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673

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Continental Prestige Electronics

USA . 4,987 parts In-Stock

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Argo Parts USA

USA . 4,349 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,526 parts In-Stock

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Perfect Parts

USA . 1,400 parts In-Stock

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Corphita

USA . 1,135 parts In-Stock

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Overview

Elevate your projects with the SN74LVC02APWTG4 by Texas Instruments, a high-quality logic gate that offers unparalleled reliability and performance. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications, from automotive to consumer electronics. With a compact design and low power consumption, this logic gate delivers exceptional value, providing customers with a cost-effective solution that doesn't compromise on quality. Upgrade your designs today with the SN74LVC02APWTG4 and experience the Texas Instruments advantage firsthand.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply:

5.5 ns - Offers fast response times, making this logic gate ideal for applications requiring quick decision-making.

Surface Mount:

YES - Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

No. of Functions:

4 - Provides versatility and flexibility in designing complex logic circuits, reducing the need for multiple separate components.

No. of Inputs:

2 - Perfect for basic logic operations and simple circuit designs.

Package Shape:

RECTANGULAR - Offers a standard form factor that is easily compatible with a wide range of circuit board layouts.

Nominal Supply Voltage / Vsup (V):

1.8 - Operates efficiently at a low voltage, saving energy and minimizing power consumption.

Load Capacitance (CL):

50 pF - Can handle a moderate amount of capacitance, making it suitable for various electronic applications.

Power Supplies (V):

3.3 - Compatible with common power sources, ensuring easy integration into existing systems.

No. of Terminals:

14 - Provides ample connection points for interfacing with other components, enabling versatile circuit designs.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Offers a compact design that saves space on the circuit board and allows for denser packing of components.

Maximum I (ol):

24 Amp - Can handle high output currents, making it suitable for driving heavy loads in industrial applications.

Propagation Delay (tpd):

10.4 ns - Balances speed and performance, providing reliable operation without sacrificing efficiency.

Maximum Operating Temperature:

125 °C - Withstands high temperatures, making it suitable for use in harsh environmental conditions.

Minimum Operating Temperature:

40 °C - Operates reliably even in extremely cold temperatures, ensuring consistent performance in various settings.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides corrosion resistance and excellent conductivity for reliable electrical connections.

Terminal Position:

DUAL - Offers flexibility in installation and connection options, accommodating different circuit board layouts.

Maximum Seated Height:

1.2 mm - Low profile design saves space and allows for compact electronic devices.

Width:

4.4 mm - Compact width enables efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup):

1.65 V - Can operate at a low voltage, making it suitable for energy-efficient applications.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during soldering processes, ensuring reliability during assembly.

Length:

5 mm - Compact length allows for efficient use of space on the circuit board.

Temperature Grade:

AUTOMOTIVE - Meets strict automotive industry standards for reliable performance in automotive applications.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation in various applications.

Terminal Form:

GULL WING - Offers a secure and reliable mounting option for easy installation on circuit boards.

Packing Method:

TR - Uses tape and reel packaging for convenient handling and storage in manufacturing environments.

Terminal Pitch:

0.65 mm - Provides precise spacing for easy soldering and connection with other components.

Maximum Supply Voltage (Vsup):

3.6 V - Can safely operate at a higher voltage, expanding its compatibility with different power sources.

Maximum Power Supply Current (ICC):

0.01 mA - Consumes minimal power, making it suitable for battery-powered devices and energy-efficient applications.

Technical Specifications

Logic Gates SN74LVC02APWTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

10.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVC02APWTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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