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SN74LV541ADBRG4

Texas Instruments

SN74LV541ADBRG4 by Texas Instruments

SN74LV541ADBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 12 ns at 2.5V, suitable for automotive applications. It features a 3-STATE output, operates b/w -40 to 125 °C, and has a max supply voltage of 5.5V. This CMOS technology device comes in a small outline package with dual terminals and nickel/palladium/gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,736 parts In-Stock

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Digiode

USA . 3,704 parts In-Stock

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Electronics Depot

USA . 489 parts In-Stock

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489

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Andel Nordic

Denmark . 1,897 parts In-Stock

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$7.657

100+ parts

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$7.350

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$7.350

1,897

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$7.350

Parana Technologies

USA . 2,146 parts In-Stock

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$17.158

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$17.374

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2,146

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AZTECH Wire

Italy . 596 parts In-Stock

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$19.170

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596

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ChromeModa Solutions

Germany . 4,639 parts In-Stock

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$19.279

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$15.809

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$19.279

$15.809

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

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$19.279

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$18.315

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$17.351

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One Stop Electronics

USA . 725 parts In-Stock

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$58.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,758 parts In-Stock

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Microchip USA

USA . 3,428 parts In-Stock

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Corphita

USA . 1,082 parts In-Stock

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DigiPath Technology Company

USA . 1,063 parts In-Stock

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$17.382

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1,063

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$17.382

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Overview

Discover the unparalleled quality and reliability of the SN74LV541ADBRG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a versatile Bus Driver & Transceiver, this product is ideal for a wide range of applications. With its innovative design and advanced features, it provides exceptional value and benefits to customers. Experience seamless performance and efficiency with this high-quality component that sets new standards in the industry. Elevate your projects with the SN74LV541ADBRG4 and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay ensures fast and efficient communication within the bus system, reducing latency and improving overall performance.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for compact design, ideal for space-constrained applications.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission scenarios, making it versatile and suitable for diverse communication needs.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage of 2.5V helps in reducing power consumption, making it energy-efficient and cost-effective for long-term use.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission without any distortion, providing reliable communication within the bus network.

Technical Specifications

Bus Driver & Transceivers SN74LV541ADBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LV541ADBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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