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SN74LV373ATDWG4

Texas Instruments

SN74LV373ATDWG4 by Texas Instruments

SN74LV373ATDWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 15ns at 5V. It operates at a supply voltage of 3.3V, has a load capacitance of 50pF, and features 3-STATE output characteristics. This CMOS technology device is ideal for automotive applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,889 parts In-Stock

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Digiode

USA . 1,525 parts In-Stock

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1,525

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Distributors (Availability)

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AZTECH Wire

Italy . 834 parts In-Stock

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$5.357

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834

$5.357

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Parana Technologies

USA . 1,222 parts In-Stock

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$22.853

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$23.514

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$22.853

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ChromeModa Solutions

Germany . 6,517 parts In-Stock

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$25.677

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$21.055

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$25.677

$21.055

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IDEA Electronic Components Group

UK . 168 parts In-Stock

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$25.677

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$24.393

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$23.109

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168

$25.677

$24.393

$23.109

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One Stop Electronics

USA . 1,302 parts In-Stock

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$63.000

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$63.000

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Andel Nordic

Denmark . 3,720 parts In-Stock

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$94.966

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$91.168

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$91.168

3,720

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$91.168

Corphita

USA . 3,255 parts In-Stock

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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$23.150

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$23.150

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Microchip USA

USA . 121 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the SN74LV373ATDWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in the Bus Driver & Transceivers category. This product is designed to provide seamless integration and reliable operation for a wide range of applications. With a focus on efficiency and functionality, the SN74LV373ATDWG4 offers customers exceptional value and benefits, making it the ideal choice for your next project. Elevate your designs with Texas Instruments and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making it suitable for automotive applications.

Propagation Delay At Nominal Supply: 15 ns

Fast propagation delay ensures quick data transmission, ideal for high-speed communication.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, making it easy to integrate into existing systems.

Output Characteristics: 3-STATE

Supports 3-state outputs for efficient bus communication and data control.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments, ensuring consistent performance in varying temperature conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LV373ATDWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74LV373ATDWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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