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SN74LV32APWRG4

Texas Instruments

SN74LV32APWRG4 by Texas Instruments

SN74LV32APWRG4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 2.5V to 5.5V, with a propagation delay of 13ns to 19ns. This CMOS technology device is ideal for automotive applications due to its small outline package and wide temperature range from -40°C to 125°C.

Median Price

$0.574

Lifecycle Status

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8

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1k+

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Texas Instruments

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Mouser Electronics

USA . 2,056 parts In-Stock

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$0.660

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$0.511

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$0.377

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$0.240

2,056

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$0.240

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Nova Conductors

Japan . 50 parts In-Stock

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50

$0.229

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Digiode

USA . 3,348 parts In-Stock

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Chip Stock

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Vyrian

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QIE Inc.

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NPI Materials, Inc.

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South Africa . 1,009 parts In-Stock

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Argo Parts USA

USA . 4,910 parts In-Stock

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$0.229

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$0.223

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Continental Prestige Electronics

USA . 3,832 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.225

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Semicontronic

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$0.405

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$0.403

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Ampacity Inc.

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Corphita

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Component Stockers USA

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Parana Technologies

USA . 436 parts In-Stock

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$21.016

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436

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ChromeModa Solutions

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$23.614

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IDEA Electronic Components Group

UK . 374 parts In-Stock

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Perfect Parts

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Microchip USA

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DigiPath Technology Company

USA . 396 parts In-Stock

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Overview

Looking for high-quality logic gates to enhance your electronic projects? Look no further than the Texas Instruments SN74LV32APWRG4! With a reputable manufacturer like Texas Instruments behind it, this product offers reliability and performance. Whether you're working on automotive applications or other electronics projects, this logic gate is sure to provide value with its fast propagation delay and low power consumption. Upgrade your designs with the SN74LV32APWRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to damage, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 13 ns

With a fast propagation delay, this product allows for quick signal processing, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable facilitates easy installation and saves space on the PCB, making it suitable for compact designs.

No. of Functions: 4

The multiple functions offered by this product provide versatility and flexibility in circuit design.

No. of Inputs: 2

With 2 inputs, this product can handle a variety of input signals, increasing its compatibility with different systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient PCB layout and easy integration into existing designs.

Nominal Supply Voltage / Vsup (V): 2.5

With a low nominal supply voltage, this product is energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance value helps in determining the capability of the product to drive capacitive loads, making it suitable for such applications.

Power Supplies (V): 3.3

The availability of multiple power supplies allows for compatibility with a range of systems and voltage levels.

No. of Terminals: 14

The ample number of terminals makes it easy to connect the product to external components, enhancing its usability.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space and allows for dense PCB layouts, making it suitable for applications with space constraints.

Maximum I (ol): 12 Amp

With a high maximum output current, this product can drive heavy loads without overheating or performance degradation.

Propagation Delay (tpd): 19 ns

The low propagation delay ensures fast signal processing, making this product ideal for time-critical applications.

Maximum Operating Temperature: 125 °C

The wide operating temperature range ensures reliability in harsh environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this product suitable for use in cold environments or outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances the product's durability and ensures reliable connections with external components.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and allow for easy connection to other components.

Maximum Seated Height: 1.2 mm

The low seated height of the package ensures compatibility with slim enclosures and allows for compact device designs.

Width: 4.4 mm

The compact width of the product enables space-saving PCB layouts and makes it suitable for small form factor devices.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage requirement, this product can operate efficiently even with limited power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliability during the soldering process, making it easy to integrate into manufacturing processes.

Length: 5 mm

The compact length of the product allows for efficient use of space on the PCB, making it suitable for designs with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in harsh automotive environments, making it ideal for automotive electronics applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure connections, enhancing the reliability of the product.

Packing Method: TR

The tape and reel packing method enables efficient handling and placement of the product during manufacturing, ensuring cost-effectiveness and ease of use.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for high-density PCB layouts and compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage tolerance enhances the product's compatibility with a wide range of power sources and systems.

Maximum Power Supply Current (ICC): 0.02 mA

With a low maximum power supply current requirement, this product offers energy efficiency and can operate with minimal power consumption.

Technical Specifications

Logic Gates SN74LV32APWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV32APWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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