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SN74LV14ANSRG4

Texas Instruments

SN74LV14ANSRG4 by Texas Instruments

SN74LV14ANSRG4 by Texas Instruments is a CMOS logic gate with 6 functions, featuring a propagation delay of 27 ns and operating temperature range from -40 to 125 °C. It has a small outline package style, Schmitt trigger technology, and is suitable for automotive applications due to its nickel/palladium/gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 5,200 parts In-Stock

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Digiode

USA . 4,054 parts In-Stock

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Vyrian

USA . 3,206 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 1,047 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 721 parts In-Stock

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$8.405

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Parana Technologies

USA . 1,026 parts In-Stock

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$16.196

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$16.516

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$17.834

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$17.834

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ChromeModa Solutions

Germany . 3,637 parts In-Stock

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$18.198

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$14.922

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IDEA Electronic Components Group

UK . 220 parts In-Stock

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$18.198

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$17.288

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$16.378

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Ampacity Inc.

Singapore . 204 parts In-Stock

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$33.000

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Component Stockers USA

USA . 601 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Continental Prestige Electronics

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Overview

Elevate your electronic projects with the SN74LV14ANSRG4 by Texas Instruments, a high-quality logic gates component that delivers superior performance and reliability. Designed with cutting-edge technology and innovative features, this product offers unmatched value and benefits for a wide range of applications in the automotive industry and beyond. With its fast propagation delay, low power consumption, and Schmitt trigger functionality, this versatile component is an essential tool for achieving seamless operation and optimal results in your designs. Trust Texas Instruments for excellence in engineering and elevate your projects to new heights with the SN74LV14ANSRG4.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the components inside.

Propagation Delay At Nominal Supply

18.5 ns - This low propagation delay ensures fast and efficient signal processing.

Surface Mount

YES - Allows for easy and secure installation on circuit boards.

No. of Functions

6 - Offers versatility and multiple functions in one unit.

Package Shape

RECTANGULAR - Fits easily into standard circuit layouts and designs.

Nominal Supply Voltage / Vsup (V)

2.5 - Compatible with a wide range of power supply configurations.

Load Capacitance (CL)

50 pF - Suitable for driving various loads within the circuit.

Power Supplies (V)

3.3 - Works efficiently with common power supply voltages.

No. of Terminals

14 - Provides ample connections for integration with other components.

Package Style (Meter)

SMALL OUTLINE - Saves space in compact circuit designs.

Maximum I (ol)

12 Amp - Can handle high currents without overheating or malfunctioning.

Propagation Delay (tpd)

27 ns - Ensures quick response times in signal processing.

Maximum Operating Temperature

125 °C - Can withstand high temperatures in various environments.

Minimum Operating Temperature

40 °C - Functions reliably even in extreme cold conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Ensures strong and stable connections.

Terminal Position

DUAL - Allows for various mounting and connection options.

Maximum Seated Height

2 mm - Low profile design fits easily into tight spaces in circuits.

Width

5.3 mm - Compact size for efficient use of circuit board space.

Minimum Supply Voltage (Vsup)

2 V - Can operate effectively with low voltage power sources.

Peak Reflow Temperature °C

260 - Suitable for soldering processes without damage.

Length

10.2 mm - Standard length for easy integration into circuit layouts.

Temperature Grade

AUTOMOTIVE - Designed to withstand automotive environmental conditions.

Schmitt Trigger

YES - Provides noise immunity and signal conditioning for reliable operation.

Technology

CMOS - Offers low power consumption and high noise immunity.

Terminal Form

GULL WING - Facilitates easy and secure soldering onto circuit boards.

Packing Method

TR - Convenient packaging for storage and transportation.

Terminal Pitch

1.27 mm - Standard pitch for compatibility with common circuit board designs.

Maximum Supply Voltage (Vsup)

5.5 V - Can handle high voltage inputs without damage.

Maximum Power Supply Current (ICC)

0.02 mA - Consumes low power for efficient operation.

Technical Specifications

Logic Gates SN74LV14ANSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

18.5 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LV14ANSRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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