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SN74LS26DE4

Texas Instruments

SN74LS26DE4 by Texas Instruments

SN74LS26DE4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 28 ns at 5V, making it suitable for applications requiring fast response times. With open-collector output characteristics, this device is ideal for digital circuit designs where low power consumption is essential.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,778 parts In-Stock

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Digiode

USA . 4,207 parts In-Stock

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4,207

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Distributors (Availability)

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AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$14.459

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327

$14.459

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Parana Technologies

USA . 1,326 parts In-Stock

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$23.039

100+ parts

$2,139.478

1k+ parts

$20.735

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1,326

$23.039

$2,139.478

$20.735

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DigiPath Technology Company

USA . 761 parts In-Stock

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$25.368

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761

$25.368

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ChromeModa Solutions

Germany . 5,577 parts In-Stock

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$25.886

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$21.227

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5,577

$25.886

$21.227

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IDEA Electronic Components Group

UK . 767 parts In-Stock

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$25.886

100+ parts

$24.592

1k+ parts

$23.297

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767

$25.886

$24.592

$23.297

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One Stop Electronics

USA . 499 parts In-Stock

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$33.000

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499

$33.000

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Component Stockers USA

USA . 763 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,933 parts In-Stock

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Corphita

USA . 3,943 parts In-Stock

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Perfect Parts

USA . 448 parts In-Stock

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Overview

Unlock the power of reliable and high-quality logic gates with the SN74LS26DE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. The SN74LS26DE4 is perfect for a wide range of applications thanks to its versatility and efficiency. With fast propagation delay and open-collector output characteristics, this product offers exceptional value and benefits to customers looking for a reliable solution for their electronic projects. Experience the advantages of Texas Instruments technology with the SN74LS26DE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast signal processing, making the product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes the product compatible with a wide range of systems and circuits.

No. of Functions: 4

Having 4 functions in one component saves space, reduces component count, and simplifies circuit design.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with different logic levels and devices, increasing flexibility in circuit design.

Technology: TTL

Using TTL technology ensures compatibility with other TTL logic devices, providing a reliable and standardized communication protocol.

Technical Specifications

Logic Gates SN74LS26DE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

4.4 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LS26DE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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