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SN74HC573ADWG4

Texas Instruments

SN74HC573ADWG4 by Texas Instruments

SN74HC573ADWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 44ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast data transmission in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 52,399 parts In-Stock

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Sensible Micro Corp

USA . 5,960 parts In-Stock

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Vyrian

USA . 5,161 parts In-Stock

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Digiode

USA . 3,322 parts In-Stock

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Semi Source

USA . 426 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 104 parts In-Stock

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Nova Conductors

Japan . 41 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 500 parts In-Stock

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$5.249

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-

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$5.039

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$5.039

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$5.249

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$5.039

$5.039

One Stop Electronics

USA . 1,373 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 472 parts In-Stock

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$7.975

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Semicontronic

India . 713 parts In-Stock

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$14.000

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$13.650

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$13.580

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Corohmni

South Africa . 1,123 parts In-Stock

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$17.963

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Parana Technologies

USA . 1,225 parts In-Stock

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$22.249

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$22.920

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DigiPath Technology Company

USA . 1,274 parts In-Stock

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$24.499

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ChromeModa Solutions

Germany . 6,894 parts In-Stock

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$24.999

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$20.499

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IDEA Electronic Components Group

UK . 2,358 parts In-Stock

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$24.999

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$23.749

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$22.499

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Ampacity Inc.

Singapore . 1,028 parts In-Stock

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Continental Prestige Electronics

USA . 3,389 parts In-Stock

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Perfect Parts

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Corphita

USA . 1,487 parts In-Stock

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Argo Parts USA

USA . 1,308 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Microchip USA

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Overview

Unlock seamless data transfer and efficient bus control with the SN74HC573ADWG4 by Texas Instruments. Manufactured with top-quality materials, this bus driver and transceiver offer reliable performance in industrial applications. With 8 bits and a compact small outline package, this product ensures fast propagation delay and low power consumption, making it a cost-effective solution for your design needs. Trust Texas Instruments for superior quality and innovation in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for industrial applications.

Propagation Delay At Nominal Supply: 44 ns

The low propagation delay ensures fast and efficient signal transmission, making it ideal for high-speed communication systems.

Surface Mount: YES

The surface mount design allows for easy installation and saves valuable space on a PCB, making it a convenient choice for compact designs.

Package Shape: RECTANGULAR

The rectangular shape offers a standardized form factor that can easily be integrated into existing circuit layouts, simplifying the design process.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle complex data transmission tasks, making it suitable for multi-channel communication systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and widely supported, ensuring compatibility with a wide range of components and systems.

Load Capacitance (CL): 50 pF

The low capacitance minimizes signal degradation and interference, ensuring reliable data transmission over long distances.

Power Supplies (V): 2/6

With support for both 2V and 6V power supplies, this device offers flexibility in various voltage requirements for different applications.

No. of Terminals: 20

The 20 terminals provide ample connection points for interfacing with other components, making it versatile for a range of system configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting, making it suitable for compact electronic devices.

Technical Specifications

Bus Driver & Transceivers SN74HC573ADWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74HC573ADWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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