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SN74HC21QDRG4Q1

Texas Instruments

SN74HC21QDRG4Q1 by Texas Instruments

SN74HC21QDRG4Q1 by Texas Instruments is a logic gate with 2 functions, 4 inputs, and propagation delay of 33 ns at 5V. It is designed for automotive applications, featuring AEC-Q100 screening level and operating temperature range from -40 to 125°C. The package style is small outline with dual terminal position and Gull Wing form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,259 parts In-Stock

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5,259

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Digiode

USA . 1,089 parts In-Stock

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1,089

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Distributors (Availability)

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AZTECH Wire

Italy . 238 parts In-Stock

1+ parts

$11.882

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238

$11.882

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One Stop Electronics

USA . 1,350 parts In-Stock

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$22.000

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1,350

$22.000

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Parana Technologies

USA . 2,038 parts In-Stock

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$27.340

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$34.758

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2,038

$27.340

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$34.758

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DigiPath Technology Company

USA . 2,287 parts In-Stock

1+ parts

$30.105

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$27.696

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2,287

$30.105

$27.696

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IDEA Electronic Components Group

UK . 471 parts In-Stock

1+ parts

$30.719

100+ parts

$29.183

1k+ parts

$27.647

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471

$30.719

$29.183

$27.647

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ChromeModa Solutions

Germany . 327 parts In-Stock

1+ parts

$30.719

100+ parts

$25.190

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327

$30.719

$25.190

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Corphita

USA . 2,545 parts In-Stock

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Microchip USA

USA . 1,881 parts In-Stock

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1,881

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74HC21QDRG4Q1 Logic Gates. Designed for automotive applications, this product offers unmatched performance and efficiency. With a wide range of functions and inputs, this logic gate is perfect for demanding environments where precision and speed are essential. Trust Texas Instruments to deliver innovative solutions that exceed expectations. Choose the SN74HC21QDRG4Q1 for your next project and experience the difference in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and ensures the product can withstand environmental conditions, making it a reliable choice.

Propagation Delay At Nominal Supply: 33 ns

The fast propagation delay of 33 ns ensures efficient signal processing and quick response time, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on a PCB, making it a convenient option for compact electronic designs.

No. of Functions: 2

Having 2 functions in a single component increases functionality and reduces the need for additional components, simplifying circuit design.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making it suitable for automotive applications where durability is crucial.

Technical Specifications

Logic Gates SN74HC21QDRG4Q1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74HC21QDRG4Q1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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