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SN74HC08DTE4

Texas Instruments

SN74HC08DTE4 by Texas Instruments

SN74HC08DTE4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 25 ns at 5V, making it suitable for industrial applications. With a small outline package style and dual terminal position, it operates within a temperature range of -40 to 85°C.

Median Price

$0.501

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.501

10k+ parts

$0.427

667

-

-

$0.501

$0.427

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.526

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-

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870

$0.526

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Chip Stock

USA . 122,730 parts In-Stock

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122,730

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Vyrian

USA . 4,932 parts In-Stock

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4,932

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Sensible Micro Corp

USA . 927 parts In-Stock

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927

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Digiode

USA . 552 parts In-Stock

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552

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Distributors (Availability)

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Semicontronic

India . 364 parts In-Stock

1+ parts

$0.426

100+ parts

$0.415

1k+ parts

$0.413

10k+ parts

-

364

$0.426

$0.415

$0.413

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Ampacity Inc.

Singapore . 313 parts In-Stock

1+ parts

$0.426

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313

$0.426

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.515

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$0.495

10k+ parts

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2,000

$0.515

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$0.495

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Continental Prestige Electronics

USA . 6,628 parts In-Stock

1+ parts

$0.526

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$0.515

6,628

$0.526

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$0.515

Argo Parts USA

USA . 2,152 parts In-Stock

1+ parts

$0.526

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$0.510

2,152

$0.526

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$0.510

Corohmni

South Africa . 428 parts In-Stock

1+ parts

$8.838

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428

$8.838

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$10.718

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$10.182

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$10.182

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150

$10.718

$10.182

$10.182

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AZTECH Wire

Italy . 392 parts In-Stock

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$16.780

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392

$16.780

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Parana Technologies

USA . 1,346 parts In-Stock

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$24.388

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$25.063

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1,346

$24.388

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$25.063

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ChromeModa Solutions

Germany . 5,389 parts In-Stock

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$27.402

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$22.470

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5,389

$27.402

$22.470

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IDEA Electronic Components Group

UK . 980 parts In-Stock

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$27.402

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$26.032

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$24.662

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980

$27.402

$26.032

$24.662

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Component Stockers USA

USA . 729 parts In-Stock

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$99.990

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729

$99.990

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Microchip USA

USA . 2,354 parts In-Stock

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2,354

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Corphita

USA . 1,770 parts In-Stock

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Perfect Parts

USA . 1,417 parts In-Stock

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1,417

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DigiPath Technology Company

USA . 1,325 parts In-Stock

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$24.706

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1,325

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$24.706

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Overview

Enhance your electronic projects with the SN74HC08DTE4 logic gates from Texas Instruments. With a reputation for top-quality manufacturing, TI delivers reliable components for a variety of applications. Whether you're working on digital circuits, amplifiers, or microcontrollers, these logic gates offer fast propagation delays and low power consumption, making them a valuable choice for your designs. Trust in Texas Instruments to provide the performance and efficiency you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy package body material provides durability and protection for the internal components of the logic gates, making them suitable for various environments.

Propagation Delay At Nominal Supply: 25 ns

Low propagation delay ensures fast signal processing and response time, making these logic gates ideal for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional components, saving cost and board space in circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes these logic gates compatible with a wide range of other components and systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and stability even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates SN74HC08DTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

SN74HC08DTE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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