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SN74HC05PWRG4

Texas Instruments

SN74HC05PWRG4 by Texas Instruments

SN74HC05PWRG4 by Texas Instruments is a logic gate with 6 functions, featuring a propagation delay of 29ns at 5V. With open-drain output characteristics, it operates in temperatures ranging from -40 to 125°C. Ideal for automotive applications due to its thin profile and small outline package style.

Median Price

$0.433

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$0.433

100+ parts

$0.294

1k+ parts

$0.151

10k+ parts

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3,950

$0.433

$0.294

$0.151

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Distributors (In-Stock)

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Digiode

USA . 1,236 parts In-Stock

1+ parts

$0.411

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1,236

$0.411

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Chip Stock

USA . 10,920 parts In-Stock

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10,920

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Vyrian

USA . 8,067 parts In-Stock

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8,067

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EMSNET

USA . 4,250 parts In-Stock

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4,250

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Distributors (Availability)

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Corphita

USA . 1,701 parts In-Stock

1+ parts

$0.390

100+ parts

-

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1,701

$0.390

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AZTECH Wire

Italy . 758 parts In-Stock

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$12.170

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758

$12.170

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Parana Technologies

USA . 1,327 parts In-Stock

1+ parts

$14.063

100+ parts

-

1k+ parts

$14.529

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1,327

$14.063

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$14.529

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DigiPath Technology Company

USA . 307 parts In-Stock

1+ parts

$15.485

100+ parts

$14.246

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307

$15.485

$14.246

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$15.801

100+ parts

$15.011

1k+ parts

$14.221

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2,254

$15.801

$15.011

$14.221

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ChromeModa Solutions

Germany . 667 parts In-Stock

1+ parts

$15.801

100+ parts

$12.957

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667

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Microchip USA

USA . 1,417 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments SN74HC05PWRG4 Logic Gates. Known for their superior quality and reliability, Texas Instruments produces cutting-edge components that deliver exceptional performance. These logic gates are versatile and efficient, making them perfect for a wide range of applications. From automotives to consumer electronics, this product offers value, efficiency, and precision that will take your projects to the next level. Choose Texas Instruments for innovation you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, providing a reliable housing for the logic gates.

Propagation Delay At Nominal Supply: 29 ns

With a low propagation delay, the logic gates can process signals quickly and efficiently.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration with other components straightforward and convenient.

Output Characteristics: OPEN-DRAIN

Open-drain outputs allow for easy interfacing with other digital components, enhancing compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates efficient and reliable.

Technical Specifications

Logic Gates SN74HC05PWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

145 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC05PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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