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SN74HC02PWG4

Texas Instruments

SN74HC02PWG4 by Texas Instruments

SN74HC02PWG4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 23 ns at 5V, suitable for industrial applications. This small outline package with dual terminals operates b/w -40 to 85°C, making it ideal for high-speed circuit designs.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 775 parts In-Stock

1+ parts

$1.110

100+ parts

$0.768

1k+ parts

$0.635

10k+ parts

$0.444

775

$1.110

$0.768

$0.635

$0.444

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,762 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

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-

3,762

$1.054

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Chip Stock

USA . 25,620 parts In-Stock

1+ parts

-

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25,620

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Vyrian

USA . 4,279 parts In-Stock

1+ parts

-

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4,279

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,814 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

1,814

$0.999

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-

-

Parana Technologies

USA . 780 parts In-Stock

1+ parts

$18.732

100+ parts

-

1k+ parts

$18.823

10k+ parts

-

780

$18.732

-

$18.823

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DigiPath Technology Company

USA . 2,176 parts In-Stock

1+ parts

$20.626

100+ parts

-

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-

10k+ parts

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2,176

$20.626

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-

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ChromeModa Solutions

Germany . 4,962 parts In-Stock

1+ parts

$21.047

100+ parts

$17.259

1k+ parts

-

10k+ parts

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4,962

$21.047

$17.259

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$21.047

100+ parts

$19.995

1k+ parts

$18.942

10k+ parts

-

2,020

$21.047

$19.995

$18.942

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Perfect Parts

USA . 5,443 parts In-Stock

1+ parts

-

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5,443

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Microchip USA

USA . 1,472 parts In-Stock

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1,472

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Overview

Unlock the power of advanced logic gates with the Texas Instruments SN74HC02PWG4. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers superior quality and reliability in every product. The SN74HC02PWG4 is perfect for a wide range of applications, offering fast propagation delays and low power consumption. Experience seamless integration and high performance in a compact package, making it an ideal choice for industrial-grade projects. Upgrade your designs with the SN74HC02PWG4 and discover the value of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to damage, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 23 ns

The low propagation delay at nominal supply ensures fast processing of signals, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, making it efficient for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V allows for compatibility with standard electronic systems, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures, suitable for industrial environments.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Logic Gates SN74HC02PWG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

115 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74HC02PWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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