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SN74GTLP1394RGYR

Texas Instruments

SN74GTLP1394RGYR by Texas Instruments

SN74GTLP1394RGYR by Texas Instruments is a 2-bit bus driver with 3-STATE output, operating at a supply voltage of 3.3V. With a propagation delay of 9ns, it is ideal for industrial applications requiring fast signal transmission in compact spaces due to its small package size and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,270 parts In-Stock

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8,270

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Digiode

USA . 3,208 parts In-Stock

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3,208

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Distributors (Availability)

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Andel Nordic

Denmark . 3,124 parts In-Stock

1+ parts

$1.807

100+ parts

-

1k+ parts

$1.735

10k+ parts

$1.735

3,124

$1.807

-

$1.735

$1.735

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$11.186

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819

$11.186

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Parana Technologies

USA . 1,484 parts In-Stock

1+ parts

$20.494

100+ parts

$1,903.182

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$18.445

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1,484

$20.494

$1,903.182

$18.445

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DigiPath Technology Company

USA . 1,098 parts In-Stock

1+ parts

$22.566

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1,098

$22.566

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ChromeModa Solutions

Germany . 3,176 parts In-Stock

1+ parts

$23.027

100+ parts

$18.882

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3,176

$23.027

$18.882

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IDEA Electronic Components Group

UK . 239 parts In-Stock

1+ parts

$23.027

100+ parts

$21.876

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$20.724

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239

$23.027

$21.876

$20.724

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One Stop Electronics

USA . 554 parts In-Stock

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$39.000

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554

$39.000

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Corphita

USA . 3,340 parts In-Stock

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3,340

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Microchip USA

USA . 344 parts In-Stock

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344

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Overview

Upgrade your bus driver and transceiver needs with the SN74GTLP1394RGYR by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers top-quality products that meet the highest industry standards. Ideal for a wide range of applications, this chip carrier with a very thin profile offers customers a reliable solution with configurable output polarity and a fast propagation delay of just 9 ns. Experience the benefits of superior performance, versatility, and efficiency with the SN74GTLP1394RGYR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for use in transportation vehicles.

Surface Mount: YES

The surface mount feature allows for easy installation and maintenance of the product, making it convenient for integration into existing systems.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, providing reliable performance across various applications.

Propagation Delay (tpd): 9 ns

The low propagation delay of 9 ns ensures fast and efficient data transmission, facilitating real-time communication in bus systems.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for efficient bus communication and signal management.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74GTLP1394RGYR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

GTLP

JESD-30 Code:

R-PQCC-N16

Length:

4 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

SN74GTLP1394RGYR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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