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SN74CBTD3305CPWRE4

Texas Instruments

SN74CBTD3305CPWRE4 by Texas Instruments

SN74CBTD3305CPWRE4 by Texas Instruments is a 2-function bus driver with 3-STATE output. It operates at a supply voltage of 5V, has a propagation delay of 0.15ns, and can withstand temperatures from -40 to 85°C. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,253 parts In-Stock

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Digiode

USA . 2,124 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,129 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 882 parts In-Stock

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$13.889

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882

$13.889

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Parana Technologies

USA . 1,115 parts In-Stock

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$20.675

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$1,919.960

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$18.607

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1,115

$20.675

$1,919.960

$18.607

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DigiPath Technology Company

USA . 220 parts In-Stock

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$22.765

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220

$22.765

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ChromeModa Solutions

Germany . 4,218 parts In-Stock

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$23.230

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$19.049

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$23.230

$19.049

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IDEA Electronic Components Group

UK . 1,383 parts In-Stock

1+ parts

$23.230

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$22.068

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$20.907

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1,383

$23.230

$22.068

$20.907

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Corphita

USA . 3,978 parts In-Stock

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Andel Nordic

Denmark . 3,917 parts In-Stock

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Microchip USA

USA . 455 parts In-Stock

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Overview

Enhance your electronic designs with the SN74CBTD3305CPWRE4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch bus drivers & transceivers like this one. With its versatile applications, this component offers customers unparalleled value and benefits. Say goodbye to connectivity issues and hello to seamless data transmission. Upgrade your projects today with the SN74CBTD3305CPWRE4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the bus driver & transceivers, making it suitable for use in various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers dual functionality in a single component, maximizing space utilization and simplifying design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 0.15 ns

Provides fast signal transmission, reducing latency and improving overall system performance.

Temperature Grade: INDUSTRIAL

Can withstand a wide range of temperatures, making it suitable for industrial settings where temperature fluctuations are common.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, resulting in efficient and reliable operation.

Technical Specifications

Bus Driver & Transceivers SN74CBTD3305CPWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SN74CBTD3305CPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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