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SN74CBT3257CPWRG4

Texas Instruments

SN74CBT3257CPWRG4 by Texas Instruments

SN74CBT3257CPWRG4 by Texas Instruments is a 4-function bus driver with 0.15 ns propagation delay, ideal for industrial applications. It features 3-state output characteristics, operates at a nominal voltage of 5V, and has a small outline package style. With bidirectional control type and enable low feature, it offers fast signal transmission in compact designs.

Median Price

$0.585

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 59,990 parts In-Stock

1+ parts

$0.585

100+ parts

$0.398

1k+ parts

$0.204

10k+ parts

-

59,990

$0.585

$0.398

$0.204

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$0.204

100+ parts

-

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-

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-

86

$0.204

-

-

-

Digiode

USA . 3,355 parts In-Stock

1+ parts

$0.556

100+ parts

-

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-

10k+ parts

-

3,355

$0.556

-

-

-

Chip Stock

USA . 19,940 parts In-Stock

1+ parts

-

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19,940

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Semtec, LLC

USA . 8,000 parts In-Stock

1+ parts

-

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8,000

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Vyrian

USA . 6,569 parts In-Stock

1+ parts

-

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6,569

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-

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Velocity Electronics

USA . 3,097 parts In-Stock

1+ parts

-

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3,097

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,894 parts In-Stock

1+ parts

$0.204

100+ parts

-

1k+ parts

-

10k+ parts

$0.198

3,894

$0.204

-

-

$0.198

Continental Prestige Electronics

USA . 3,592 parts In-Stock

1+ parts

$0.204

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

3,592

$0.204

-

-

$0.200

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.204

100+ parts

-

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1,000

$0.204

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-

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Ampacity Inc.

Singapore . 59,527 parts In-Stock

1+ parts

$0.497

100+ parts

-

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-

10k+ parts

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59,527

$0.497

-

-

-

Corphita

USA . 4,536 parts In-Stock

1+ parts

$0.526

100+ parts

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4,536

$0.526

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-

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AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$15.120

100+ parts

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531

$15.120

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Parana Technologies

USA . 2,281 parts In-Stock

1+ parts

$28.286

100+ parts

-

1k+ parts

$45.756

10k+ parts

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2,281

$28.286

-

$45.756

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DigiPath Technology Company

USA . 10 parts In-Stock

1+ parts

$31.146

100+ parts

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10

$31.146

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IDEA Electronic Components Group

UK . 2,188 parts In-Stock

1+ parts

$31.782

100+ parts

$30.193

1k+ parts

$28.604

10k+ parts

-

2,188

$31.782

$30.193

$28.604

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

1+ parts

$31.782

100+ parts

$26.061

1k+ parts

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1,571

$31.782

$26.061

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Microchip USA

USA . 2,642 parts In-Stock

1+ parts

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2,642

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A-Z Elektronik GmbH

Germany . 1,365 parts In-Stock

1+ parts

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1,365

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Kepictronics

USA . 360 parts In-Stock

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360

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Overview

Unlock the power of seamless data transfer with the SN74CBT3257CPWRG4 by Texas Instruments. This high-quality bus driver and transceiver, designed with cutting-edge CMOS technology, offers unparalleled performance and reliability. Ideal for industrial applications, this versatile component boasts a compact design and low power consumption, making it an essential tool for optimizing your project's efficiency. Trust Texas Instruments to deliver innovative solutions that drive your success forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 0.15 ns

Ensures fast signal transmission and response times, ideal for high-speed data communication applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during the assembly process.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional devices and simplifying circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level commonly used in electronic systems, ensuring compatibility with existing power sources.

Load Capacitance (CL): 50 pF

Provides a suitable load for the device to function optimally, maintaining signal integrity and reducing interference.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers SN74CBT3257CPWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CBT3257CPWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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