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SN74CBT3253CDRG4

Texas Instruments

SN74CBT3253CDRG4 by Texas Instruments

SN74CBT3253CDRG4 by Texas Instruments is a 2-function bus driver with 0.15 ns propagation delay, suitable for industrial applications. It operates at 5V with 16 terminals in a small outline package, featuring true output polarity and 3-state characteristics.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,557 parts In-Stock

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Digiode

USA . 4,117 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 15,539 parts In-Stock

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$3.990

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$3.990

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AZTECH Wire

Italy . 864 parts In-Stock

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$11.592

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864

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One Stop Electronics

USA . 300 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,446 parts In-Stock

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$24.092

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$24.744

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$24.744

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

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$27.070

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$25.716

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$24.363

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2,143

$27.070

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$24.363

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ChromeModa Solutions

Germany . 1,686 parts In-Stock

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$27.070

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$22.197

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QUARKTWIN TECHNOLOGY LTD

USA . 23,397 parts In-Stock

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Corphita

USA . 4,534 parts In-Stock

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Microchip USA

USA . 1,768 parts In-Stock

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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$24.406

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Overview

Experience unparalleled quality and reliability with the Texas Instruments SN74CBT3253CDRG4 Bus Driver & Transceivers. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology and innovative solutions. Ideal for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Trust in the unmatched performance and efficiency of the SN74CBT3253CDRG4 for all your bus driver and transceiver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication.

Surface Mount: YES

Being surface mountable, this product allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 2

Having multiple functions in one component saves space on the PCB and reduces the overall cost of the system.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can drive capacitive loads efficiently without signal degradation.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and performance of the product.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and flexibility for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with limited space.

Output Characteristics: 3-STATE

The 3-state output allows for tri-state logic, giving more flexibility and control over the output signals.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable solder joints.

Technical Specifications

Bus Driver & Transceivers SN74CBT3253CDRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74CBT3253CDRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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