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SN74CBT1G125DCKT

Texas Instruments

SN74CBT1G125DCKT by Texas Instruments

SN74CBT1G125DCKT by Texas Instruments is a 3-STATE bus driver with 0.25 ns propagation delay, suitable for bidirectional applications. It operates at 5V with a load capacitance of 50 pF and features a small outline package style. Ideal for industrial use, it has dual terminal position and enables low control type.

Median Price

$0.772

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,850 parts In-Stock

1+ parts

$0.970

100+ parts

$0.555

1k+ parts

$0.486

10k+ parts

$0.467

1,850

$0.970

$0.555

$0.486

$0.467

Mouser Electronics

USA . 244 parts In-Stock

1+ parts

$0.970

100+ parts

$0.555

1k+ parts

$0.467

10k+ parts

$0.454

244

$0.970

$0.555

$0.467

$0.454

Rochester

USA . 42,500 parts In-Stock

1+ parts

-

100+ parts

$0.552

1k+ parts

$0.458

10k+ parts

$0.408

42,500

-

$0.552

$0.458

$0.408

Verical

USA . 41,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.573

10k+ parts

$0.510

41,750

-

-

$0.573

$0.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,058 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

3,058

$0.390

-

-

-

Chip Stock

USA . 66,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66,700

-

-

-

-

DigiKey Marketplace

USA . 43,000 parts In-Stock

1+ parts

-

100+ parts

$0.410

1k+ parts

-

10k+ parts

-

43,000

-

$0.410

-

-

Vyrian

USA . 7,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,873

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,783 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

-

10k+ parts

-

2,783

$0.369

-

-

-

Component Stockers USA

USA . 51,076 parts In-Stock

1+ parts

$0.400

100+ parts

$0.380

1k+ parts

$0.340

10k+ parts

$0.340

51,076

$0.400

$0.380

$0.340

$0.340

Parana Technologies

USA . 1,914 parts In-Stock

1+ parts

$29.046

100+ parts

-

1k+ parts

$54.766

10k+ parts

-

1,914

$29.046

-

$54.766

-

DigiPath Technology Company

USA . 1,284 parts In-Stock

1+ parts

$31.983

100+ parts

$29.425

1k+ parts

-

10k+ parts

-

1,284

$31.983

$29.425

-

-

ChromeModa Solutions

Germany . 3,332 parts In-Stock

1+ parts

$32.636

100+ parts

$26.762

1k+ parts

-

10k+ parts

-

3,332

$32.636

$26.762

-

-

IDEA Electronic Components Group

UK . 1,610 parts In-Stock

1+ parts

$32.636

100+ parts

$31.004

1k+ parts

$29.372

10k+ parts

-

1,610

$32.636

$31.004

$29.372

-

Microchip USA

USA . 1,652 parts In-Stock

1+ parts

$155.270

100+ parts

$151.130

1k+ parts

$149.060

10k+ parts

$146.990

1,652

$155.270

$151.130

$149.060

$146.990

Perfect Parts

USA . 2,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,173

-

-

-

-

Kepictronics

USA . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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540

-

-

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-

Overview

Experience seamless data transmission with the Texas Instruments SN74CBT1G125DCKT, a high-quality bus driver & transceiver designed for industrial applications. With a propagation delay of just 0.25 ns and a 3-state output, this compact device ensures fast and reliable communication within your system. Texas Instruments, known for their cutting-edge technology and superior performance, brings you a product that offers unmatched value and efficiency. Say goodbye to delays and errors - choose the SN74CBT1G125DCKT for your next project and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures quick and efficient data transmission.

Surface Mount: YES

Surface mount capability enables easy installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage for compatibility with various systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal power consumption and efficient operation.

Power Supplies (V): 5

The 5V power supply support provides stable performance.

No. of Terminals: 5

5 terminals offer flexible connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact design of the package saves space and allows for high-density integration.

Propagation Delay (tpd): 0.35 ns

Low propagation delay ensures fast signal transmission.

Maximum Operating Temperature: 85 °C

Operates efficiently in a wide range of temperatures up to 85°C.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance when disabled, reducing power consumption.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments down to -40°C.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of Nickel/Palladium/Gold finish provides corrosion resistance and good conductivity.

No. of Ports: 2

2 ports offer multiple connection options for data transmission.

Maximum Seated Height: 1.1 mm

Low seated height allows for compact and slim designs in electronic systems.

Width: 1.25 mm

Narrow width enables easy integration in tight spaces.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission.

Minimum Supply Voltage (Vsup): 4 V

Operates effectively even at a minimum supply voltage of 4V.

Peak Reflow Temperature °C: 260

Supports high reflow temperatures for reliable soldering during assembly.

Length: 2 mm

Compact length allows for efficient space utilization on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and are suitable for surface mounting.

Packing Method: TR

TR packing method ensures safe transportation and storage of the product.

Terminal Pitch: 0.65 mm

0.65 mm terminal pitch allows for precise connections in compact spaces.

Count Direction: BIDIRECTIONAL

Bidirectional count direction offers versatility in data transmission.

Control Type: ENABLE LOW

Enable low control type ensures efficient management of the device.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V for safe operation within specified limits.

Maximum Power Supply Current (ICC): 0.001 mA

Low power supply current of 0.001 mA ensures energy efficiency.

Technical Specifications

Bus Driver & Transceivers SN74CBT1G125DCKT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.001 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

SN74CBT1G125DCKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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