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SN74CB3T3125PWG4

Texas Instruments

SN74CB3T3125PWG4 by Texas Instruments

SN74CB3T3125PWG4 by Texas Instruments is a 4-function bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and supports both 2.5V and 3.3V power supplies. This CMOS technology device features a small outline package with dual terminal position and true output polarity, making it ideal for bidirectional control applications.

Median Price

$1.270

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

200

-

$1.270

$1.140

$1.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,284 parts In-Stock

1+ parts

$1.178

100+ parts

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1,284

$1.178

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Vyrian

USA . 7,212 parts In-Stock

1+ parts

-

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7,212

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Chip Stock

USA . 585 parts In-Stock

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585

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Semi Source

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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Corphita

USA . 2,694 parts In-Stock

1+ parts

$1.116

100+ parts

-

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2,694

$1.116

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Andel Nordic

Denmark . 3,916 parts In-Stock

1+ parts

$7.702

100+ parts

-

1k+ parts

$7.394

10k+ parts

$7.394

3,916

$7.702

-

$7.394

$7.394

AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$22.230

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1,023

$22.230

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Parana Technologies

USA . 1,094 parts In-Stock

1+ parts

$29.443

100+ parts

$2,734.227

1k+ parts

$26.499

10k+ parts

-

1,094

$29.443

$2,734.227

$26.499

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

$32.420

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1,059

$32.420

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ChromeModa Solutions

Germany . 2,691 parts In-Stock

1+ parts

$33.082

100+ parts

$27.127

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2,691

$33.082

$27.127

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$33.082

100+ parts

$31.428

1k+ parts

$29.774

10k+ parts

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2,285

$33.082

$31.428

$29.774

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Microchip USA

USA . 2,069 parts In-Stock

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2,069

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Perfect Parts

USA . 604 parts In-Stock

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604

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Overview

Unleash the power of seamless data transmission with the SN74CB3T3125PWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality components that guarantee reliability and efficiency. The Bus Driver & Transceivers category of this product offers unparalleled performance and versatility in various applications. With a nominal supply voltage of 2.5V and a propagation delay of 0.25ns, this small outline, thin profile package provides customers with a compact yet powerful solution for their electronic needs. Elevate your projects with the SN74CB3T3125PWG4 and experience the difference in quality and performance that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the bus driver & transceiver, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 0.25 ns

The low propagation delay of 0.25 ns ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it suitable for compact electronic devices or applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V provides compatibility with standard power sources, making integration into existing systems seamless.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for flexible control of the output signal, enabling multiplexing or bus sharing capabilities in the system.

Technology: CMOS

The CMOS technology used in this bus driver & transceiver ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Bus Driver & Transceivers SN74CB3T3125PWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74CB3T3125PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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