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SN74BCT373DBRG4

Texas Instruments

SN74BCT373DBRG4 by Texas Instruments

SN74BCT373DBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for commercial applications. It features a small outline package with dual terminals and operates b/w 0 to 70°C temperature range. The device supports a load capacitance of 50 pF and offers true output polarity in a surface-mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,794 parts In-Stock

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Digiode

USA . 2,521 parts In-Stock

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2,521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,424 parts In-Stock

1+ parts

$2.807

100+ parts

-

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$2.694

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$2.694

5,424

$2.807

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$2.694

$2.694

Parana Technologies

USA . 808 parts In-Stock

1+ parts

$7.836

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$8.388

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808

$7.836

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$8.388

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

1+ parts

$8.804

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$8.364

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$7.924

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2,319

$8.804

$8.364

$7.924

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ChromeModa Solutions

Germany . 1,843 parts In-Stock

1+ parts

$8.804

100+ parts

$7.219

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1,843

$8.804

$7.219

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AZTECH Wire

Italy . 652 parts In-Stock

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$18.878

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652

$18.878

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One Stop Electronics

USA . 907 parts In-Stock

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$53.000

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907

$53.000

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Corphita

USA . 4,613 parts In-Stock

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4,613

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DigiPath Technology Company

USA . 557 parts In-Stock

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$7.938

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557

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$7.938

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Microchip USA

USA . 447 parts In-Stock

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Overview

Enhance your electronic designs with the SN74BCT373DBRG4 by Texas Instruments, a top-quality bus driver & transceiver that offers reliable performance and seamless connectivity. Crafted by a trusted manufacturer, this product is ideal for a wide range of applications, providing customers with exceptional value and superior benefits. Upgrade your projects with ease and efficiency using this innovative component, designed to meet your needs and exceed your expectations. Elevate your engineering endeavors with the SN74BCT373DBRG4 and experience unmatched quality and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 8

With 8 bits, this product can handle a wide range of digital signals and data, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with most systems and ensures reliable performance.

Load Capacitance (CL): 50 pF

A low load capacitance helps in reducing signal distortion and interference, ensuring accurate data transmission.

Power Supplies (V): 5

Having a consistent power supply voltage of 5V ensures stability and consistent performance of the product.

No. of Terminals: 20

The higher number of terminals allows for more connectivity options and versatility in system integration.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This compact package style saves space on the PCB, making it suitable for applications with limited board space.

Maximum I (ol): 64 Amp

High output current capability of 64A ensures that the product can drive power-hungry loads effectively.

Propagation Delay (tpd): 9.3 ns

Low propagation delay ensures fast signal transmission, minimizing signal skew and improving overall system performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can operate reliably in a wide range of environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance output, enabling easy interfacing with other devices without causing any interference.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and allows for different mounting options, enhancing design possibilities.

No. of Ports: 2

Having 2 ports enables multiple connections and communication pathways, making the product more versatile for various applications.

Maximum Seated Height: 2 mm

Low seated height helps in minimizing the overall height of the system, making it suitable for applications with space constraints.

Width: 5.3 mm

Compact width makes the product suitable for applications where space-saving is crucial, without compromising on performance.

Output Polarity: TRUE

True output polarity ensures correct signal interpretation and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5V allows for operation in low-power scenarios and extends the product's compatibility range.

Length: 7.2 mm

Compact length makes the product suitable for applications with limited board space, without sacrificing functionality.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance ensures reliable performance in standard operating conditions, making it suitable for most applications.

Technology: BICMOS

BiCMOS technology combines the benefits of bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and mounting on PCBs, ensuring secure connections and reliable operation.

Packing Method: TR

TR packing method provides convenience in handling and storage, making it easy to transport and use the product efficiently.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting, enhancing the product's versatility and compatibility with various PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers a safety margin for voltage spikes and fluctuations, ensuring the product's durability and longevity.

Technical Specifications

Bus Driver & Transceivers SN74BCT373DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74BCT373DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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