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SN74AUP3G06RSER

Texas Instruments

SN74AUP3G06RSER by Texas Instruments

SN74AUP3G06RSER by Texas Instruments is a logic gate with 19.3 ns propagation delay, 1.2V nominal voltage, and 30 pF load capacitance. It is used in industrial applications requiring open-drain output characteristics and operates within a temperature range of -40 to 85°C.

Median Price

$0.783

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 378,610 parts In-Stock

1+ parts

$0.783

100+ parts

$0.602

1k+ parts

$0.317

10k+ parts

-

378,610

$0.783

$0.602

$0.317

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,042 parts In-Stock

1+ parts

$0.744

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

$0.744

-

-

-

Vyrian

USA . 2,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,542

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,077 parts In-Stock

1+ parts

$0.705

100+ parts

-

1k+ parts

-

10k+ parts

-

4,077

$0.705

-

-

-

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$10.620

100+ parts

-

1k+ parts

-

10k+ parts

-

528

$10.620

-

-

-

Parana Technologies

USA . 982 parts In-Stock

1+ parts

$26.672

100+ parts

-

1k+ parts

$27.228

10k+ parts

-

982

$26.672

-

$27.228

-

IDEA Electronic Components Group

UK . 1,287 parts In-Stock

1+ parts

$29.969

100+ parts

$28.471

1k+ parts

$26.972

10k+ parts

-

1,287

$29.969

$28.471

$26.972

-

ChromeModa Solutions

Germany . 370 parts In-Stock

1+ parts

$29.969

100+ parts

$24.575

1k+ parts

-

10k+ parts

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370

$29.969

$24.575

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-

DigiPath Technology Company

USA . 2,199 parts In-Stock

1+ parts

-

100+ parts

$27.020

1k+ parts

-

10k+ parts

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2,199

-

$27.020

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-

ChipstoGo Electronic ltd

UK . 955 parts In-Stock

1+ parts

-

100+ parts

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955

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Overview

Elevate your electronic projects with the high-quality SN74AUP3G06RSER Logic Gates by Texas Instruments. Designed with precision and reliability in mind, this product offers exceptional performance and versatility for a wide range of applications. From industrial automation to consumer electronics, this chip carrier with a very thin profile provides fast propagation delay and low power consumption, making it an ideal choice for your next project. Trust Texas Instruments for cutting-edge technology and innovation that delivers value and benefits to customers like you. Upgrade your designs with the SN74AUP3G06RSER today and experience the difference.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 19.3 ns

Low propagation delay ensures fast response time and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and increasing design flexibility.

No. of Functions: 3

Multiple functions in a single component offer versatility and simplify circuit design.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a common supply voltage of 1.2V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliability in challenging industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Logic Gates SN74AUP3G06RSER attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

19.3 ns

Propagation Delay (tpd):

19.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

1.5 mm

Trade Compliance

SN74AUP3G06RSER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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