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SN74AUC32374ZKER

Texas Instruments

SN74AUC32374ZKER by Texas Instruments

SN74AUC32374ZKER by Texas Instruments is an 8-bit bus driver with 4 functions, featuring a propagation delay of 4.5 ns and operating temperature range from -40 to 85°C. Ideal for industrial applications requiring high-speed data transmission in compact spaces due to its low profile grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,165 parts In-Stock

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Digiode

USA . 3,033 parts In-Stock

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3,033

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Bristol Electronics

USA . 712 parts In-Stock

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712

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Dan-Mar Components

USA . 712 parts In-Stock

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712

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ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,471 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

$2.571

10k+ parts

$2.571

4,471

$2.679

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$2.571

$2.571

One Stop Electronics

USA . 1,230 parts In-Stock

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$10.000

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1,230

$10.000

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AZTECH Wire

Italy . 362 parts In-Stock

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$12.305

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362

$12.305

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Parana Technologies

USA . 2,186 parts In-Stock

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$23.447

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$24.084

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2,186

$23.447

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$24.084

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ChromeModa Solutions

Germany . 5,065 parts In-Stock

1+ parts

$26.345

100+ parts

$21.603

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5,065

$26.345

$21.603

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IDEA Electronic Components Group

UK . 594 parts In-Stock

1+ parts

$26.345

100+ parts

$25.028

1k+ parts

$23.710

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594

$26.345

$25.028

$23.710

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QUARKTWIN TECHNOLOGY LTD

USA . 6,458 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Corphita

USA . 1,082 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 500 parts In-Stock

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500

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DigiPath Technology Company

USA . 362 parts In-Stock

1+ parts

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$23.753

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362

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$23.753

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Microchip USA

USA . 177 parts In-Stock

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177

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Overview

Elevate your electronic designs with the high-quality SN74AUC32374ZKER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable bus drivers and transceivers that cater to a wide range of applications. With a focus on performance, efficiency, and innovation, this product offers exceptional value and benefits to customers. Experience seamless integration, fast propagation delay, and versatile functionality with the SN74AUC32374ZKER, setting a new standard for excellence in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible makes installation easier and allows for more compact designs in electronic systems.

Nominal Supply Voltage / Vsup (V): 1.2

The nominal supply voltage of 1.2V makes this product efficient in terms of power consumption.

No. of Terminals: 96

Having 96 terminals provides ample connectivity options and versatility in connecting to other components within a circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance even in demanding environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Bus Driver & Transceivers SN74AUC32374ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

AUC

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Trade Compliance

SN74AUC32374ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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