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SN74ALVTH16373GR

Texas Instruments

SN74ALVTH16373GR by Texas Instruments

SN74ALVTH16373GR by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and 3-STATE output. It operates at a nominal voltage of 2.5V, has a propagation delay of 4.2 ns, and can handle load capacitance up to 30 pF. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$1.120

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Rochester

USA . 138 parts In-Stock

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$0.875

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$0.823

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$0.744

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138

$0.875

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Chip1Stop

Japan . 27 parts In-Stock

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$1.120

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$1.112

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Arrow

USA . 27 parts In-Stock

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$1.122

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$1.112

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27

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$1.112

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DF Sales Co.

USA . 203 parts In-Stock

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$0.600

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DF Sales Co.

USA . 203 parts In-Stock

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Digiode

USA . 4,419 parts In-Stock

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$0.831

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TME

Poland . 8,000 parts In-Stock

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$0.562

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Vyrian

USA . 7,857 parts In-Stock

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Prism Electronics

USA . 4,032 parts In-Stock

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Chip Stock

USA . 3,980 parts In-Stock

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Bristol Electronics

USA . 2,726 parts In-Stock

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Atlantic Semiconductor

USA . 1,777 parts In-Stock

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Inventory MP

USA . 1,249 parts In-Stock

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Extreme Components

USA . 417 parts In-Stock

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PC Components Company LLC

USA . 52 parts In-Stock

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Speed Components Ltd

Israel . 50 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,465 parts In-Stock

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$0.788

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$0.788

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Andel Nordic

Denmark . 1,421 parts In-Stock

1+ parts

$7.741

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$7.431

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$7.431

1,421

$7.741

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$7.431

$7.431

AZTECH Wire

Italy . 947 parts In-Stock

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$17.060

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947

$17.060

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Parana Technologies

USA . 1,085 parts In-Stock

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$21.822

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$22.298

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$21.822

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DigiPath Technology Company

USA . 388 parts In-Stock

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$24.029

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$22.106

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388

$24.029

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ChromeModa Solutions

Germany . 4,543 parts In-Stock

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$24.519

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$20.106

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IDEA Electronic Components Group

UK . 1,116 parts In-Stock

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$24.519

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$23.293

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$22.067

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Perfect Parts

USA . 31,586 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,216 parts In-Stock

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Glotronic Ltd.

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 1,032 parts In-Stock

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GreenTree Electronics

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Overview

Discover the versatility and reliability of the SN74ALVTH16373GR by Texas Instruments, a top-tier manufacturer known for delivering high-quality electronic components. As part of the Bus Driver & Transceivers category, this product offers seamless integration and superior performance in various applications. With a low propagation delay, 3-state output characteristics, and dual terminal position, this product provides exceptional value and benefits to customers seeking efficient and dependable solutions for their projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.2 ns

The low propagation delay ensures fast data transmission and quick response times, making it ideal for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

No. of Functions: 2

Having multiple functions in a single package provides versatility and reduces the need for multiple components, simplifying the design and reducing costs.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, making it compatible with standard manufacturing processes and equipment.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage allows for energy-efficient operation while maintaining reliable performance.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures proper signal integrity and compatibility with various system configurations.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages gives flexibility in system integration and compatibility with different voltage standards.

No. of Terminals: 48

Having a high number of terminals enables connectivity to multiple external components, expanding the product's versatility and functionality.

Maximum I (ol): 64 Amp

The high maximum output current capability allows for driving larger loads, making it suitable for demanding applications.

Propagation Delay (tpd): 4.5 ns

The specified propagation delay ensures precise timing and accurate data transmission in communication systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in various environmental conditions and industrial settings.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for bus sharing and multiple driver connections, enhancing system flexibility and design options.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables operation in extreme cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The specified terminal finish provides reliable contact points and resistance to corrosion, ensuring long-term connectivity.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and design, accommodating different board configurations and space constraints.

No. of Ports: 2

Having multiple ports allows for versatile connectivity options and signal routing, making the product suitable for diverse communication needs.

Width: 6.1 mm

The compact width dimension saves space on the PCB, allowing for more efficient design layouts and compact system integration.

Output Polarity: TRUE

Having true output polarity ensures proper signal interpretation and compatibility with standard logic levels, simplifying system integration.

Minimum Supply Voltage (Vsup): 2.3 V

The low minimum supply voltage requirement allows for operation in low-power environments while maintaining reliable performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robustness during soldering processes, preventing damage to the component.

Length: 12.5 mm

The specified length dimension ensures compatibility with standard PCB footprints and allows for easy integration into various system designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and performance in harsh operating conditions, suitable for industrial applications.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance with low power consumption.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder connections and mechanical stability during PCB assembly and operation.

Packing Method: TR

The TR packing method ensures proper protection during shipping and handling, reducing the risk of damage and ensuring product integrity.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for dense packing and miniaturization of components on the PCB, optimizing space efficiency.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies system design and communication protocols, ensuring straightforward data transmission and control.

Control Type: ENABLE LOW/HIGH

The enable low/high control type offers flexibility in system operation and integration, allowing for customized control and functionality.

Maximum Supply Voltage (Vsup): 2.7 V

The specified maximum supply voltage ensures safe operation within the rated voltage range, preventing overvoltage damage to the component.

Maximum Power Supply Current (ICC): 5 mA

The low maximum power supply current requirement indicates energy efficiency and minimal power consumption, contributing to overall system performance.

Technical Specifications

Bus Driver & Transceivers SN74ALVTH16373GR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ALVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.1 mm

Trade Compliance

SN74ALVTH16373GR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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