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SN74ALS642A-1DWRE4

Texas Instruments

SN74ALS642A-1DWRE4 by Texas Instruments

SN74ALS642A-1DWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 30ns at 5V. It features open-collector output and operates b/w 0 to 70°C, making it suitable for bidirectional control applications. This small outline package has a dual terminal position and Gull Wing form factor for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,790 parts In-Stock

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7,790

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Digiode

USA . 1,958 parts In-Stock

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1,958

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Distributors (Availability)

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AZTECH Wire

Italy . 846 parts In-Stock

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$15.999

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846

$15.999

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Andel Nordic

Denmark . 2,544 parts In-Stock

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$18.246

100+ parts

-

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$17.516

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$17.516

2,544

$18.246

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$17.516

$17.516

Parana Technologies

USA . 1,060 parts In-Stock

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$22.382

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$23.057

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1,060

$22.382

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$23.057

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DigiPath Technology Company

USA . 823 parts In-Stock

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$24.645

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823

$24.645

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ChromeModa Solutions

Germany . 5,638 parts In-Stock

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$25.148

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$20.621

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5,638

$25.148

$20.621

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IDEA Electronic Components Group

UK . 1,173 parts In-Stock

1+ parts

$25.148

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$23.891

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$22.633

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1,173

$25.148

$23.891

$22.633

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One Stop Electronics

USA . 640 parts In-Stock

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$26.000

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640

$26.000

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Corphita

USA . 1,895 parts In-Stock

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Microchip USA

USA . 303 parts In-Stock

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Overview

Upgrade your electronic designs with the SN74ALS642A-1DWRE4 by Texas Instruments, a high-quality Bus Driver & Transceiver that offers unmatched performance and reliability. Manufactured by the trusted brand Texas Instruments, this product is ideal for a wide range of applications. With its advanced features and innovative design, the SN74ALS642A-1DWRE4 provides exceptional value to customers by delivering fast propagation delay, low power consumption, and precise output characteristics. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 30 ns

Fast propagation delay ensures quick transmission of signals, improving overall performance of the bus driver.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with various systems and devices.

Output Characteristics: OPEN-COLLECTOR

Allows for easy interfacing with other components, enhancing the versatility of the bus driver.

Technology: TTL

Utilizes TTL technology known for its reliability and high-speed performance, ensuring accurate signal transmission.

Technical Specifications

Bus Driver & Transceivers SN74ALS642A-1DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

28 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ALS642A-1DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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