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SN74ALS35ADRE4

Texas Instruments

SN74ALS35ADRE4 by Texas Instruments

SN74ALS35ADRE4 by Texas Instruments is a TTL logic gate with 6 functions, 50 ns propagation delay at 5V. It has open-collector output and operates b/w 0-70°C. Ideal for applications requiring fast signal processing in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,943 parts In-Stock

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Digiode

USA . 2,591 parts In-Stock

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2,591

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One Stop Electronics

USA . 405 parts In-Stock

1+ parts

$9.000

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405

$9.000

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AZTECH Wire

Italy . 470 parts In-Stock

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$18.317

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470

$18.317

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Parana Technologies

USA . 2,107 parts In-Stock

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$29.465

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$59.657

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2,107

$29.465

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$59.657

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DigiPath Technology Company

USA . 1,375 parts In-Stock

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$32.445

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$29.849

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1,375

$32.445

$29.849

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ChromeModa Solutions

Germany . 2,932 parts In-Stock

1+ parts

$33.107

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$27.148

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2,932

$33.107

$27.148

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$33.107

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$31.452

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$29.796

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1,212

$33.107

$31.452

$29.796

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Semicontronic

India . 1,105 parts In-Stock

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$54.000

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$52.650

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$52.380

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$54.000

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$52.380

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Ampacity Inc.

Singapore . 1,432 parts In-Stock

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$62.000

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$62.000

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Microchip USA

USA . 4,867 parts In-Stock

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Corphita

USA . 4,061 parts In-Stock

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Corohmni

South Africa . 468 parts In-Stock

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468

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Overview

Elevate your projects with the SN74ALS35ADRE4 by Texas Instruments, a top-quality logic gate that offers exceptional performance and reliability. With a wide range of applications in various industries, this product is designed to meet your needs with its advanced technology and superior construction. Experience the benefits of faster propagation delays and open-collector output characteristics, all packaged in a compact, easy-to-install form. Trust Texas Instruments for innovative solutions that deliver value and efficiency to your projects. Upgrade to the SN74ALS35ADRE4 today and elevate your design capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or applications requiring long-term reliability.

Propagation Delay At Nominal Supply: 50 ns

With a low propagation delay, this product ensures fast signal processing, making it suitable for high-speed applications where timing is critical.

Surface Mount: YES

Being surface mountable, this product simplifies the assembly process and allows for compact design, saving space on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage, this product is compatible with a wide range of systems and can be easily integrated into existing circuits.

Output Characteristics: OPEN-COLLECTOR

The open-collector output design allows for easy interfacing with other components or devices, giving the product versatility in various circuit configurations.

Technical Specifications

Logic Gates SN74ALS35ADRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

6.3 mA

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74ALS35ADRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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