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SN74ALS245ANSRG4

Texas Instruments

SN74ALS245ANSRG4 by Texas Instruments

SN74ALS245ANSRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10ns at 5V. It features a small outline package, operates b/w 0-70°C, and has a max power supply current of 58mA. Ideal for bidirectional control applications in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,383 parts In-Stock

1+ parts

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5,383

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Digiode

USA . 4,017 parts In-Stock

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4,017

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Distributors (Availability)

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Andel Nordic

Denmark . 3,615 parts In-Stock

1+ parts

$4.752

100+ parts

-

1k+ parts

$4.562

10k+ parts

$4.562

3,615

$4.752

-

$4.562

$4.562

Parana Technologies

USA . 1,089 parts In-Stock

1+ parts

$7.952

100+ parts

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$8.523

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1,089

$7.952

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$8.523

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DigiPath Technology Company

USA . 2,293 parts In-Stock

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$8.756

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2,293

$8.756

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ChromeModa Solutions

Germany . 2,741 parts In-Stock

1+ parts

$8.935

100+ parts

$7.327

1k+ parts

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2,741

$8.935

$7.327

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IDEA Electronic Components Group

UK . 1,117 parts In-Stock

1+ parts

$8.935

100+ parts

$8.488

1k+ parts

$8.042

10k+ parts

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1,117

$8.935

$8.488

$8.042

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AZTECH Wire

Italy . 641 parts In-Stock

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$13.087

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641

$13.087

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One Stop Electronics

USA . 1,551 parts In-Stock

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$31.000

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1,551

$31.000

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Corphita

USA . 4,966 parts In-Stock

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Microchip USA

USA . 2,431 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ALS245ANSRG4 by Texas Instruments, a top-quality bus driver and transceiver that delivers unparalleled performance. Manufactured by Texas Instruments, known for their cutting-edge technology and reliability, this product offers fast propagation delay and true output polarity. With a compact package style and dual terminal position, this versatile component is ideal for a wide range of applications. Experience seamless data transmission and efficient operation with the SN74ALS245ANSRG4, providing unmatched value and benefits to all customers seeking high-quality electronic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 10 ns

With a low propagation delay, this product ensures fast and efficient communication within the bus system.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and simplifying the assembly process.

No. of Bits: 8

This product can handle 8 bits of data, providing ample capacity for communication between various components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Maximum I (ol): 24 Amp

The high maximum output current allows for robust signal transmission across the bus network.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature operation.

Technology: TTL

Using TTL technology ensures reliable and accurate signal processing for communication within the bus system.

Technical Specifications

Bus Driver & Transceivers SN74ALS245ANSRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL,84030012A,8403001RA,8403001SA IS DELETED FOR SUBGROUP FIX

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

58 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ALS245ANSRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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