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SN74AHCT16540DLR

Texas Instruments

SN74AHCT16540DLR by Texas Instruments

SN74AHCT16540DLR by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns at 5V, featuring a small outline package style for industrial applications. It offers 3-STATE output characteristics, operates b/w -40 to 85°C, and has a max seated height of 2.79 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,581 parts In-Stock

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7,581

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Digiode

USA . 1,443 parts In-Stock

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1,443

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Distributors (Availability)

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Andel Nordic

Denmark . 2,676 parts In-Stock

1+ parts

$3.820

100+ parts

-

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$3.667

10k+ parts

$3.667

2,676

$3.820

-

$3.667

$3.667

AZTECH Wire

Italy . 248 parts In-Stock

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$13.953

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248

$13.953

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Parana Technologies

USA . 550 parts In-Stock

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$25.387

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$26.010

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550

$25.387

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$26.010

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DigiPath Technology Company

USA . 939 parts In-Stock

1+ parts

$27.954

100+ parts

$25.718

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939

$27.954

$25.718

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IDEA Electronic Components Group

UK . 541 parts In-Stock

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$28.525

100+ parts

$27.099

1k+ parts

$25.672

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541

$28.525

$27.099

$25.672

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ChromeModa Solutions

Germany . 263 parts In-Stock

1+ parts

$28.525

100+ parts

$23.390

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263

$28.525

$23.390

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One Stop Electronics

USA . 955 parts In-Stock

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$43.000

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955

$43.000

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QUARKTWIN TECHNOLOGY LTD

USA . 25,354 parts In-Stock

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Corphita

USA . 3,073 parts In-Stock

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3,073

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Microchip USA

USA . 137 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the SN74AHCT16540DLR from Texas Instruments, a leading manufacturer known for top-quality components. This Bus Driver & Transceiver offers seamless data transfer with its 8-bit functionality and 3-STATE output characteristics. With a small outline package, industrial temperature grade, and a maximum seated height of 2.79mm, this versatile component is perfect for a wide range of applications. Experience faster propagation delays and reliable operation with the SN74AHCT16540DLR, providing exceptional value and efficiency to customers seeking top-notch electronic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in bus driver applications.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures fast signal transmission, enhancing the efficiency of the bus driver and transceiver function.

Surface Mount: YES

The surface mount capability makes installation easy and saves space on the PCB, making it suitable for compact bus driver designs.

No. of Functions: 2

Having 2 functions in a single component adds versatility to the product, allowing for multiple operations within the bus driver and transceiver system.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing bus systems.

Power Supplies (V): 5

The 5V power supply ensures consistent and reliable performance of the bus driver and transceiver.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting the component to other parts of the circuit, allowing for customization and complex signal routing.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it suitable for bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74AHCT16540DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

SN74AHCT16540DLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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