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SN74ACT04NSRG4

Texas Instruments

SN74ACT04NSRG4 by Texas Instruments

SN74ACT04NSRG4 by Texas Instruments is a logic gate with 6 functions, 9ns propagation delay at 5V. It operates in industrial temperatures from -40 to 85°C and has a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,556 parts In-Stock

1+ parts

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5,556

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Digiode

USA . 2,946 parts In-Stock

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2,946

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 7 parts In-Stock

1+ parts

$13.097

100+ parts

-

1k+ parts

$13.598

10k+ parts

-

7

$13.097

-

$13.598

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$13.700

100+ parts

-

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687

$13.700

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$14.422

100+ parts

$13.268

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1,646

$14.422

$13.268

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ChromeModa Solutions

Germany . 3,993 parts In-Stock

1+ parts

$14.716

100+ parts

$12.067

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3,993

$14.716

$12.067

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

1+ parts

$14.716

100+ parts

$13.980

1k+ parts

$13.244

10k+ parts

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1,843

$14.716

$13.980

$13.244

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One Stop Electronics

USA . 321 parts In-Stock

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$63.000

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321

$63.000

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Corphita

USA . 4,429 parts In-Stock

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4,429

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Microchip USA

USA . 2,819 parts In-Stock

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Perfect Parts

USA . 1,850 parts In-Stock

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1,850

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Overview

Enhance your electronic projects with the SN74ACT04NSRG4 by Texas Instruments, a top-quality logic gate that offers exceptional performance and reliability. With Texas Instruments' renowned reputation for innovation and excellence in manufacturing, you can trust that this component will meet your needs. Ideal for a variety of applications, this logic gate provides fast propagation delay and low power consumption, making it a valuable investment for your designs. Upgrade your projects today with the SN74ACT04NSRG4 and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for electronics applications.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast operation and efficient signal processing in electronic circuits.

Surface Mount: YES

Surface mount capability allows for easy placement and soldering onto circuit boards, making installation efficient.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage is commonly used in electronic systems, ensuring compatibility with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates SN74ACT04NSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ACT04NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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