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SN74AC573DWE4

Texas Instruments

SN74AC573DWE4 by Texas Instruments

SN74AC573DWE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 15ns at 3V, suitable for industrial applications. It features a 3-STATE output and operates within a temperature range of -40 to 85°C. With surface mount capability and dual terminal position, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,897 parts In-Stock

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Vyrian

USA . 3,431 parts In-Stock

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3,431

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Chip Stock

USA . 2,670 parts In-Stock

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2,670

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Nova Conductors

Japan . 96 parts In-Stock

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Andel Nordic

Denmark . 1,967 parts In-Stock

1+ parts

$8.546

100+ parts

-

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$8.204

10k+ parts

$8.204

1,967

$8.546

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$8.204

$8.204

Corohmni

South Africa . 44 parts In-Stock

1+ parts

$11.578

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44

$11.578

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Parana Technologies

USA . 1,900 parts In-Stock

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$11.816

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$12.218

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$11.816

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$12.218

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AZTECH Wire

Italy . 834 parts In-Stock

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$12.593

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834

$12.593

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DigiPath Technology Company

USA . 1,204 parts In-Stock

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$13.010

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$11.970

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$13.010

$11.970

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ChromeModa Solutions

Germany . 4,133 parts In-Stock

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$13.276

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$10.886

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$13.276

$10.886

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

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$13.276

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$12.612

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$11.948

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2,292

$13.276

$12.612

$11.948

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One Stop Electronics

USA . 1,573 parts In-Stock

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$41.000

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$41.000

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$45.000

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$45.000

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Component Stockers USA

USA . 581 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 4,842 parts In-Stock

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Argo Parts USA

USA . 2,392 parts In-Stock

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Corphita

USA . 1,160 parts In-Stock

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Microchip USA

USA . 953 parts In-Stock

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953

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Advanced Electronics

New Zealand . 600 parts In-Stock

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600

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74AC573DWE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The SN74AC573DWE4 falls under the category of Bus Driver & Transceivers, offering fast propagation delay and 3-state output characteristics. This versatile component is perfect for various applications requiring efficient signal transmission and control. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN74AC573DWE4, guaranteeing optimal performance and precision in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making installation more convenient.

Nominal Supply Voltage / Vsup (V): 3

Operating at a low supply voltage of 3V helps in reducing power consumption and heat generation, making it energy efficient.

Output Characteristics: 3-STATE

Having 3-state output allows for greater flexibility in controlling the output signal, enabling versatile use in different circuit configurations.

Technical Specifications

Bus Driver & Transceivers SN74AC573DWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74AC573DWE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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