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SN74ABT823DBRG4

Texas Instruments

SN74ABT823DBRG4 by Texas Instruments

SN74ABT823DBRG4 by Texas Instruments is a 9-bit bus driver with 6.8 ns propagation delay at 5V, suitable for industrial applications. It features a max frequency of 125MHz, operates b/w -40 to 85°C, and has a small outline package style. The device supports independent control with dual terminal position and Gull Wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,374 parts In-Stock

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Digiode

USA . 2,242 parts In-Stock

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2,242

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Distributors (Availability)

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AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$19.153

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682

$19.153

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Parana Technologies

USA . 2,134 parts In-Stock

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$19.714

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$19.697

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2,134

$19.714

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$19.697

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ChromeModa Solutions

Germany . 2,725 parts In-Stock

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$22.150

100+ parts

$18.163

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2,725

$22.150

$18.163

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IDEA Electronic Components Group

UK . 19 parts In-Stock

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$22.150

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$21.042

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$19.935

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19

$22.150

$21.042

$19.935

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One Stop Electronics

USA . 1,002 parts In-Stock

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$37.000

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$37.000

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Corphita

USA . 4,302 parts In-Stock

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Andel Nordic

Denmark . 3,045 parts In-Stock

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Microchip USA

USA . 2,722 parts In-Stock

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DigiPath Technology Company

USA . 1,575 parts In-Stock

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$19.970

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1,575

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$19.970

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Overview

Enhance your electronic designs with the SN74ABT823DBRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that guarantee reliability and performance. This versatile product is perfect for a wide range of applications, offering customers seamless integration and superior functionality. Trust in Texas Instruments to provide you with the value, benefits, and advantages you need to take your projects to the next level. Choose the SN74ABT823DBRG4 for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast signal transmission, which is essential for efficient communication in bus driver and transceiver applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and reduces the need for additional power regulation.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the risk of errors and ensuring reliable communication.

Technical Specifications

Bus Driver & Transceivers SN74ABT823DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND CLOCK ENABLE

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

6.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74ABT823DBRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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