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SN74ABT373PWE4

Texas Instruments

SN74ABT373PWE4 by Texas Instruments

SN74ABT373PWE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.2 ns at 5V, suitable for industrial applications. It features a max I (ol) of 64A, operates b/w -40 to 85°C, and has a terminal pitch of 0.65mm. This BICMOS technology device supports true output polarity and has a package style of small outline, thin profile, shrink pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,646

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Vyrian

USA . 2,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$5.241

100+ parts

-

1k+ parts

-

10k+ parts

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481

$5.241

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Andel Nordic

Denmark . 3,641 parts In-Stock

1+ parts

$5.812

100+ parts

-

1k+ parts

$5.579

10k+ parts

$5.579

3,641

$5.812

-

$5.579

$5.579

Parana Technologies

USA . 1,020 parts In-Stock

1+ parts

$26.778

100+ parts

-

1k+ parts

$28.488

10k+ parts

-

1,020

$26.778

-

$28.488

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DigiPath Technology Company

USA . 482 parts In-Stock

1+ parts

$29.486

100+ parts

$27.127

1k+ parts

-

10k+ parts

-

482

$29.486

$27.127

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ChromeModa Solutions

Germany . 4,360 parts In-Stock

1+ parts

$30.088

100+ parts

$24.672

1k+ parts

-

10k+ parts

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4,360

$30.088

$24.672

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IDEA Electronic Components Group

UK . 295 parts In-Stock

1+ parts

$30.088

100+ parts

$28.584

1k+ parts

$27.079

10k+ parts

-

295

$30.088

$28.584

$27.079

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One Stop Electronics

USA . 780 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

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10k+ parts

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780

$32.000

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Corphita

USA . 3,732 parts In-Stock

1+ parts

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3,732

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Microchip USA

USA . 2,114 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,114

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Overview

Elevate your electronic designs with the SN74ABT373PWE4 by Texas Instruments, a top-tier manufacturer known for its high-quality components. This 8-bit bus driver & transceiver is versatile and reliable, perfect for a wide range of applications. With a low propagation delay and 3-state output characteristics, this product ensures efficient data transmission. Benefit from Texas Instruments' cutting-edge technology and industrial-grade performance, all while enjoying the compact package style and ease of surface mount installation. Upgrade your projects today with the SN74ABT373PWE4 and experience the value and precision that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 6.2 ns

With a fast propagation delay, this product ensures quick signal transmission, making it suitable for high-speed data transfer applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the product on PCBs, saving space and simplifying manufacturing processes.

No. of Bits: 8

Having 8 bits allows for a wider range of data transmission, making the product versatile and suitable for various communication protocols.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources, making integration into existing systems hassle-free.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in reducing signal distortion and maintaining signal integrity, crucial for reliable data transmission.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation of the product, reducing the risk of performance issues or failures.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity options, allowing for versatile integration into different circuit layouts and configurations.

Maximum I (ol): 64 Amp

The high output current capability of 64A ensures robust signal drive strength, making the product suitable for driving heavy loads without signal degradation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand elevated temperatures, making it suitable for industrial applications that require extended operating conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 85°C ensures reliable operation in both hot and cold environments, making the product versatile and adaptable to various conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides corrosion resistance and ensures stable electrical connections, enhancing the product's reliability and longevity.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB mounting options, enabling efficient board layout designs and simplifying installation processes.

No. of Ports: 2

Having 2 ports provides connectivity options for multiple devices or circuits, enhancing the product's versatility and compatibility with various system configurations.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm enables compact and slim product designs, ideal for space-constrained applications or densely packed PCB layouts.

Width: 4.4 mm

The narrow width of 4.4mm saves PCB space, allowing for efficient use of limited board real estate and enabling compact system designs.

Output Polarity: TRUE

The true output polarity ensures correct signal interpretation and compatibility with standard logic levels, making the product easy to integrate into existing systems.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation even when power sources fluctuate slightly, minimizing the risk of voltage-related issues or malfunctions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust soldering processes during assembly, ensuring stable and durable connections for long-term product reliability.

Length: 6.5 mm

The compact length of 6.5mm facilitates space-efficient product designs and enables versatile integration options in various electronic devices or systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the product is suitable for rugged and demanding environments, ensuring reliable operation in harsh conditions.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly, ensuring secure connections and reliable performance of the product.

Packing Method: TUBE

The tube packing method offers secure storage and transportation of the product, minimizing the risk of damage or contamination during handling and shipping.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density PCB layouts and fine-pitch component mounting, enabling compact and space-efficient circuit designs.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies data transmission and reception, ensuring consistent and reliable communication between connected devices or systems.

Control Type: ENABLE LOW

The enable low control type offers flexibility in managing device operation, allowing for efficient power management and system integration in various applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with higher voltage systems, expanding the product's applicability across a wide range of power supply configurations.

Maximum Power Supply Current (ICC): 30 mA

The maximum power supply current of 30mA indicates low power consumption, making the product energy-efficient and suitable for battery-operated or power-sensitive applications.

Technical Specifications

Bus Driver & Transceivers SN74ABT373PWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74ABT373PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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