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SN74ABT244ANSRG4

Texas Instruments

SN74ABT244ANSRG4 by Texas Instruments

SN74ABT244ANSRG4 by Texas Instruments is a 20-terminal bus driver with 4.6 ns propagation delay at 5V, suitable for industrial applications. It features 3-STATE output characteristics, operates b/w -40 to 85 °C, and has a peak reflow temperature of 260C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,545 parts In-Stock

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Digiode

USA . 3,694 parts In-Stock

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Andel Nordic

Denmark . 2,482 parts In-Stock

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$2.404

100+ parts

-

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$2.308

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$2.308

2,482

$2.404

-

$2.308

$2.308

One Stop Electronics

USA . 694 parts In-Stock

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$6.000

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694

$6.000

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AZTECH Wire

Italy . 667 parts In-Stock

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$9.651

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Parana Technologies

USA . 19 parts In-Stock

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$18.991

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$19.050

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19

$18.991

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$19.050

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DigiPath Technology Company

USA . 1,792 parts In-Stock

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$20.911

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$19.238

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1,792

$20.911

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ChromeModa Solutions

Germany . 3,142 parts In-Stock

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$21.338

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$17.497

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$21.338

$17.497

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

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$21.338

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$20.271

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$19.204

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1,945

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Component Stockers USA

USA . 728 parts In-Stock

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$99.990

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728

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Corphita

USA . 3,915 parts In-Stock

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Microchip USA

USA . 2,191 parts In-Stock

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Overview

Enhance your electronic designs with the SN74ABT244ANSRG4 by Texas Instruments, a high-quality Bus Driver & Transceiver component that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product ensures top-notch functionality and durability. Ideal for various applications, this product provides seamless data transmission, fast propagation delays, and 3-STATE output characteristics. Trust in Texas Instruments to deliver value, efficiency, and innovation with the SN74ABT244ANSRG4 for all your circuitry needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the bus driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.6 ns

Low propagation delay ensures fast and efficient signal transmission, making this bus driver suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, saving space and cost in the overall system design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems seamless and straightforward.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable signal transmission and reception, preventing issues such as signal distortion or loss.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable performance and prevents voltage fluctuations that could affect signal integrity.

No. of Terminals: 20

Having multiple terminals allows for versatile connectivity options and compatibility with a wide range of system configurations.

Maximum I (ol): 64 Amp

High output current capability of 64A ensures compatibility with a variety of loads and devices, making this bus driver versatile for different applications.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the circuit board, ideal for applications with limited board real estate.

Propagation Delay (tpd): 4.6 ns

Low propagation delay ensures minimal signal delay, enabling fast and responsive communication within the system.

Output Characteristics: 3-STATE

3-state output allows for added flexibility in controlling the output signal, enabling tristate logic operation for more complex system designs.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 to 85°C ensures reliable performance in various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability of the connections.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for efficient operation.

Packing Method: TR

Tube packaging method ensures secure transport and storage of the bus driver, protecting it from damage or contamination before installation.

Technical Specifications

Bus Driver & Transceivers SN74ABT244ANSRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ABT244ANSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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